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Open Access 26-10-2020 | TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony

Authors: S. A. Belyakov, R. J. Coyle, B. Arfaei, J. W. Xian, C. M. Gourlay

Title: Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony
Authors: S. A. Belyakov
R. J. Coyle
B. Arfaei
J. W. Xian
C. M. Gourlay
Publication date: 26-10-2020
Publisher: Springer US
Published in: Journal of Electronic Materials / Issue 3/2021
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI: https://doi.org/10.1007/s11664-020-08507-x