Skip to main content
Top
Published in: Journal of Materials Science: Materials in Electronics 1/2016

03-09-2015

Microstructure and microwave dielectric behavior of 0.6ZrO2–0.4(Zn1/3Nb2/3)O2–xSnO2–yTiO2 ceramics

Authors: Hangsheng Zhu, Zhiyuan Cui, Chunying Shen

Published in: Journal of Materials Science: Materials in Electronics | Issue 1/2016

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

0.6ZrO2–0.4(Zn1/3Nb2/3)O2–xSnO2–yTiO2 ceramics were prepared by the conventional solid state reaction method. The microstructure and microwave dielectric properties have been investigated as functions of the Sn content and sintering temperature. Scanning electron microscopy analysis demonstrated that dense ceramics were obtained. In the ceramics with x = 0.1 and 0.2, grain growth is the discontinuous-type. As x increases, the discontinuous-type of grain growth is suppressed. However, the average grain size increases. The microwave dielectric properties, especially the quality factor and temperature coefficient of resonance frequency value, were sensitive to the content of Sn. As the content of Sn increased from 0.10 to 0.40, the dielectric constant of the 0.6ZrO2–0.4(Zn1/3Nb2/3)O2–xSnO2–yTiO2 ceramics decreased gradually from 39.5 to 31.5, the Q × f value increased from 40,000 to 47,500 GHz, and τ f value shifted slightly from +4.8 to −39.1 ppm/°C. The 0.6ZrO2–0.4(Zn1/3Nb2/3)O2–0.2SnO2–0.8TiO2 ceramics sintered at 1220 °C exhibited relatively ideal dielectric properties with a dielectric constant of 36.59, Q × f value of 43,200 GHz, and temperature coefficient of resonant frequency of −5.9 ppm/ °C.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Literature
4.
5.
go back to reference H. Ohsato, I. Kagomiya, M. Terada et al., J. Eur. Ceram. Soc. 30, 315 (2010)CrossRef H. Ohsato, I. Kagomiya, M. Terada et al., J. Eur. Ceram. Soc. 30, 315 (2010)CrossRef
7.
8.
9.
go back to reference S. Vahabzadeh, M.A. Golozar, F. Ashrafizadeh, J. Alloys Compd. 509, 1129 (2011)CrossRef S. Vahabzadeh, M.A. Golozar, F. Ashrafizadeh, J. Alloys Compd. 509, 1129 (2011)CrossRef
11.
13.
go back to reference R.C. Pullar, C. Vaughan, N.M. Alford, J. Phys. D Appl. Phys. 37, 348 (2004)CrossRef R.C. Pullar, C. Vaughan, N.M. Alford, J. Phys. D Appl. Phys. 37, 348 (2004)CrossRef
14.
15.
16.
17.
19.
go back to reference R. Christoffersen, P.K. Davies, X. Wei et al., J. Am. Ceram. Soc. 77, 1441 (1994)CrossRef R. Christoffersen, P.K. Davies, X. Wei et al., J. Am. Ceram. Soc. 77, 1441 (1994)CrossRef
24.
25.
Metadata
Title
Microstructure and microwave dielectric behavior of 0.6ZrO2–0.4(Zn1/3Nb2/3)O2–xSnO2–yTiO2 ceramics
Authors
Hangsheng Zhu
Zhiyuan Cui
Chunying Shen
Publication date
03-09-2015
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 1/2016
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-015-3734-4

Other articles of this Issue 1/2016

Journal of Materials Science: Materials in Electronics 1/2016 Go to the issue