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Journal of Materials Science: Materials in Electronics

Published in:

14-11-2017

Microstructure evolution during reflow and thermal aging in a Ag@Sn TLP bondline for high-temperature power devices

Authors: Qiang Guo, Fuwen Yu, Hongtao Chen, Mingyu Li

Published in: Journal of Materials Science: Materials in Electronics | Issue 4/2018

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Abstract

In this paper, we investigated the microstructure evolution and the resulting change in mechanical properties in a Ag@Sn TLP bondline during reflow and thermal aging. A Ag@Sn high-remelting-point bondline was rapidly achieved with thermocompression bonding of Ag@Sn powder in only 5 min at 250 °C. After reducing the thickness of the Sn coating on the Ag particles, the main phases in the resulting bondlines changed from Ag/Ag₃Sn to Ag/ζ-Ag, increasing the remelting temperatures to 480 °C and above. The voids were effectively controlled by reducing the thickness of the Sn coating, thereby increasing the shear strength by 38%. The large surface area of the Ag/Sn interface, provided by a high density of core–shell Ag@Sn particles, enabled the rapid formation of an interconnection that is entirely composed of Ag and ζ-Ag. After thermal aging, the main phases transformed from Ag/ζ-Ag to Ag/Ag (Sn) solid solution/ζ-Ag, which causes an increase in the remelting temperature of aged interconnections up to 724 °C. The thermal aged samples showed slight decreases in shear strength, but the morphology of the fracture surfaces indicated better ductility.

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Title: Microstructure evolution during reflow and thermal aging in a Ag@Sn TLP bondline for high-temperature power devices
Authors: Qiang Guo
Fuwen Yu
Hongtao Chen
Mingyu Li
Publication date: 14-11-2017
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 4/2018
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-017-8232-4

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