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Journal of Materials Engineering and Performance
Published in: Journal of Materials Engineering and Performance 4/2022

24-11-2021 | Technical Article

Microstructure, Mechanical Behavior, and Thermal Conductivity of Three-Dimensionally Interconnected Hexagonal Boron Nitride-Reinforced Cu-Ni Composite

Authors: Zahid Hussain, Haneul Jang, HyunJoo Choi, Byung-Sang Choi

Published in: Journal of Materials Engineering and Performance | Issue 4/2022

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Abstract

A powder metallurgy-based strategy to in situ construct a three-dimensionally interconnected hexagonal boron nitride (3Di-hBN) layers surrounding the grains of Cu-Ni matrix through metal–organic chemical vapor deposition process was utilized to fabricate 3Di-hBN-reinforced Cu0.7-Ni0.3 (3Di hBN-Cu-Ni) composite. The effect of 3Di-hBN on the mechanical properties of 3Di hBN-Cu-Ni composite was assessed by comparing with pure Cu-Ni alloy (without hBN) fabricated via powder metallurgy route under similar processing conditions. Uniaxial tensile investigations showed that 3Di-hBN positively influenced the mechanical properties of 3Di hBN-Cu-Ni composite;  ∼16.3, ∼11.67, and ∼27.9% higher yield strength, UTS, and fracture toughness, respectively, compared to PM Cu-Ni alloy. The overall improved performance of 3Di hBN-Cu-Ni composite was attributed to the formation of 3Di-hBN layers at the interfaces of Cu-Ni grains, which enable the composite to withstand the applied load through the mechanisms of load transfer, dislocation strengthening, and grain refinement. In addition, thermal conductivity of 3Di hBN-Cu-Ni composite was found ∼10% higher than that of pure Cu-Ni alloy.
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Metadata
Title
Microstructure, Mechanical Behavior, and Thermal Conductivity of Three-Dimensionally Interconnected Hexagonal Boron Nitride-Reinforced Cu-Ni Composite
Authors
Zahid Hussain
Haneul Jang
HyunJoo Choi
Byung-Sang Choi
Publication date
24-11-2021
Publisher
Springer US
Published in
Journal of Materials Engineering and Performance / Issue 4/2022
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-021-06450-4

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