Microsystem technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2009

Excerpt

The symposium on design, test, integration and packaging of MEMS/MOEMS (DTIP) was held in Rome, Italy, 1–3 April 2009, as a follow up to previous issues held in 1999 and 2000 in Paris, France, in 2001, 2002, 2003 in Mandelieu-La Napoule, France, in 2004 and 2005 in Montreux, Switzerland, and in 2006, 2007 in Stresa, Italy and in 2008 in Nice. This series of symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. The symposium is traditionally composed of two conferences running in parallel: one on CAD, design and test (CDT), and another one on microfabrication, integration and packaging (MIP). In addition, participants of both conferences can attend invited talks and Workshops/special sessions. …