Skip to main content
Disciplines
Automotive Business IT + Informatics Construction + Real Estate Electrical Engineering + Electronics Energy + Sustainability Insurance + Risk Finance + Banking Management + Leadership Marketing + Sales Mechanical Engineering + Materials
Events
DE
EN
Books
Journals
Topic Page
Marketing
Start single access now
Access for companies
EXTENDED SEARCH
Log in
Top
Published in:
Einführung in die Sensortechnik Read chapter Read first chapter

2014 | OriginalPaper | Chapter

6. Mikrotechnologien

Authors : Holger Reinecke, Claas Müller

Published in: Sensortechnik

Publisher: Springer Berlin Heidelberg

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Zusammenfassung

Die Prozesse der Mikrotechnologien entstammen zum Großteil den Fertigungsmethoden der Mikroelektronik. Hinzu kommen verschiedene Sonderprozesse und Methoden, die speziell für die Herstellung von Mikrosensoren und Mikroaktoren entwickelt wurden. Weil diese Prozesse in der Regel eine besonders reine Arbeitsumgebung erfordern, wird am Anfang dieses Kapitels zunächst auf die grundsätzlichen Anforderungen an Reinräume eingegangen. Es werden dann die wichtigsten Prozesse der Siliziumtechnologie, der Mikromechanik, der Schichttechniken, der Verbindungs- und Kontaktiertechniken und der LIGA-Technik behandelt. Diese Ausführungen können im Rahmen dieses Handbuches naturgemäß nur in Form einer Übersicht erfolgen. Ausführliche Darstellungen dazu finden sich in der einschlägigen Spezialliteratur am Ende dieses Kapitels.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

inform now
previous chapter Modellierung und Simulation
next chapter Sondertechnologien
Literature
Abu-Zeid MM (1984) Corner undercutting in anisotropically etched isolation contours. J Electrochem Soc 131:2138CrossRef
Barth PW (1990) Silicon fusion bonding for fabrication of sensors, actuators and microstructures. Sens Actuators A21–A23:919CrossRef
Bassous E (1978) Fabrication of novel three dimensional microstructures by anisotropic etching of (100) and (110) silicon. IEEE Trans Electron Devices 25:1178CrossRef
de Boer M, Jansen H, Elwenspoek M (1995) The black silicon method v: a study of the fabrication of movable structures for micro electromechanical systems. Digest of technical papers, 8th international conference on solid-state sensors and actuators (Transducers ‘95), Stockholm, S 565
Brand FH, KT (2009) LIGA and its applications. Weinheim
Büttgenbach S (1994) Mikromechanik. Teubner-Verlag
Christel L, Petersen K, Barth P, Mallon J, Bryzek J (1990) Single crystal silicon pressure sensors with 500x overpressure protection. Sens Actuators A21–A23:84
Diem B, Truche R, Viollet-Bosson S, Delapierre G (1990) „SIMOX“ (Separation by Ion Implantation of Oxygen). A technology for high-temperature silicon sensors. Sens Actuators A21–A23:1003
Dura HG, Betz J, Mokwa W, Vogt H, Zimmer G (1990) Batch process for the production of single crystal silicon membranes by the use of SIMOX-wafer. Technical Digest MME ‘90 Workshop, Berlin, S 31
Ehrfeld W, Abraham M, Ehrfeld U, Lacher M, Lehr H (1994) Materials for LIGA products. In: Proceedings of IEEE micro electro mechanical systems workshop, Oiso, S 86
Esashi ME, Nakano A, Shoji S, Hebiguchi H (1990) Low-temperature silicon-to-silicon anodic bonding with intermediate low melting point glass. Sens Actuators A21–A23:931CrossRef
Fan L-S, Tai Y-C, Muller RS (1987) Pinjoints, gears, springs, cranks, and other novel micromechanical structures. Digest of the technical papers, 4th international conference on solid-state sensors and actuators (Transducers ‘87), Tokyo, S 849
Fan L-S, Tai Y-C, Muller RS (1988) Integrated movable micromechanical structures for sensors and actuators. IEEE Trans Electron Devices 35:724CrossRef
Frey H, Kienel G (Hrsg) (1987) Dünnschichttechnologie. VDI-Verlag
Fricke J, Obermeier E (1995) Surface micromachined accelerometer based on a torsional moving structure. Digest of the technical papers, 8th international conferance on solid-state sensors and actuators (Transducers ‘95), Stockholm, 542
Ghandhi SK (1983) VLSI fabrication principles. Wiley, Device Fabrication. McGraw-Hill
Glembocki OJ, Stahlbush RE, Tomkiewicz M (1985) Biasdependent etching of silicon in aqueous KOH. J Electrochem Soc 132:145CrossRef
Hacke H-J (1987) Montage Integrierter Schaltungen. Springer
Haefer RA (1987) Oberflächen- und Dünnschicht-Technologie, Teil I. Springer
Hanneborg A (1991) Silicon wafer bonding techniques for assembly of micromechanical elements. In: Proceedings of the IEEE micro electro mechanical systems workshop, Nara, 92
Heuberger A (Hrsg) (1989) Mikromechanik. Springer
Hirano T, Furuhata T, Gabriel KJ, Fujita H (1991) Operation of sub-micron gap electronic comb-drive actuators. Digest of the technical papers, international conference on solid-state sensors and actuators (Transducers ‘93), San Francisco, 873
Holmes PJ, Loasby RG (1976) Handbook of thick film technology. Electrochemical Publications Limited
Hosack HH, Houston TW, Pollock, GP (1990) SIMOX silicon-on-insulator: materials and devices. Solid State Technol 12:61
Jackson TN, Tischler MA, Wise KD (1981) An electrochemical pn-junction etch-stop for the formation of silicon microstructures. IEEE Electron Device Lett 2:44CrossRef
Jaecklin VP, Linder C, de Rooij NF, Moret JM (1992) Micromechanical comb actuators with low driving voltage. J Micromech Microeng 2:250CrossRef
Jones DR (1982) Hybrid circuit design and manufacture. Marcel Dekker
Juan WH, Pang SW (1995) A novel etch-diffusion process for fabricating high aspect ratio si microstructures. Digest of the technical papers, 8th international conference on solid-state sensors and actuators (Transducers‘95), Stockholm, 560
Kalem S, Werner P, Arthursson Ö, Talalaev V, Nilsson B, Hagberg M, Frederiksen H, Södervall U (2011) Black silicon with high density and high aspect ratio nanowhiskers. Nanotechnology 22(23):235307CrossRef
Kienel G (Hrsg) (1993) Vakuum-Beschichtung 4 – Anwendungen Teil I. VDI-Verlag GmbH
Klaassen EH, Petersen K, Noworolski JM, Logan J, Maluf NI, Brown J, Storment Ch, McCulley W, Kovacs GTA (1995) Silicon fusion bonding and deep reactive ion etching; a new technology for micro structures. Digest of the technical papers, 8th internatinal conference on solid-state sensors and actuators (Transducers ‘95), Stockholm, 556
Kleber W (1983) Einführung in die Kristallographie. VEB Verlag Technik, Berlin
Ko WH, Suminto JT Yeh GJ (1985) Bonding techniques for microsensors. In: Fung CD, Cheung PW, Ko WH, Fleming DG (Hrsg) Micromachining and micropackaging of transducers. Elsevier Science Publishers B.V, Amsterdam
Kovacs G, Maluf N, Petersen K (1998) Bulk micromachining of silicon. Proc IEEE 86(8):1536–51CrossRef
Krause P, Sporys M, Obermeier E, Lange K, Grigull S (1995) Silicon to silicon anodic bonding using evaporated glass. Digest of the technical papers, 8th international conference on solid-state sensors and actuators (Transducers ‘95), Stockholm, 228
Laermer F, Urban A (2005) Milestones in deep reactive ion etching, solid state sensors, actuators and microsystems. Digest of technical papers. Transducers ‘05, Bd. 2, S 1118–21
Lasky JB (1986) Waferbonding for silicon-on-insulator technologies. Appl Phys Lett 48:78CrossRef
McGuire GE (Hrsg) (1988) Semiconductor materials and process technology handbook. Noyes Publications
Meek RL (1971) Anodic dissolution of nþ-silicon. J Electrochem Soc 118:437CrossRef
Menz W, Mohr J, Paul O (2005) Mikrosystemtechnik für Ingenieure, 3. Aufl. Weinheim
Menz W (1995) LIGA and related technologies for industrial application. Digest of the technical, 8th international conference on solid-state sensors and actuators (Transducers ‘95), Stockholm, S 552
Middleman S, Hochberg AK (1993) Process engineering analysis in semiconductor device fabrication. Mc Graw-Hill
Mohr J, Bley P, Strohrmann M, Wallrabe U (1992) Microactuators fabricated by the LIGA process. J Micromech Microeng 2:234CrossRef
Movchan BA (1969) Demchishin: study of the structure and properties of thick vacuum condensates of nickel, titanium, tungsten, aluminium oxide and zirconium dioxide. Phys Met Metallogr 28:83
Muller RS (1990) Microdynamics. Sens Actuators A21–A23:1
O’Mara WC, Herring RB, Hunt LP (Hrsg) (1990) Handbook of semiconductor silicon technology. Noyes Publications
Owen KJ, VanDerElzen B, Peterson RL, Najafi K (2012) High aspect ratio deep silicon etching. S 251–54
Petersen K, Brown J, Barth P, Mallon J, Bryzek J (1990) Ultra-stable high temperature pressure sensors using silicon fusion bonding. Sens Actuators A21–A23:96
Pollak-Diener G (1989) Verbindungsverfahren für Mikrosensoren und Mikroaktuatoren. Seminarband AMA-Seminar Mikromechanik, Heidelberg, S 269
Price JB (1973) Anisotropic etching of silicon with KOH-H2O-isopropyl alcohol. In: Huff HR, Burgers RR (Hrsg) Semiconductor silicon. In: The electrochemical society softbound symposium ser., Princeton, S 339
Puers B, Sansen W (1990) Compensation structures for convex corner micromachining in silicon. Sens Actuators A21–A23:1036CrossRef
Reichl H (Hrsg) (1988) Hybridintegration. Dr. Alfred Hüthig Verlag
Reisman A, Berkenblit M, Chan SA, Kaufmann FB, Green DC (1979) The controlled etching of silicon in catalyzed ethylendiamine-pyrocatechol-water solutions. J Electrochem Soc 126:1406CrossRef
Robbins R, Schwartz B (1960) Chemical etching of silicon. J Electrochem Soc 107(2)108CrossRef
Ruge I (1984) Halbleiter-Technologie. Springer
Ryssel H, Ruge I (1978) Ionenimplantation. Teubner Verlag
Schmidt D, Bley P, Ehrfeld W, Götz F, Mohr J, Münchmeyer D (1989) Mikrostrukturierung nach dem LIGA-Verfahren. Seminarband AMA-Seminar Mikromechanik, Heidelberg, S 95
Schnegraf KK (Hrsg) (1988) Handbook of thin-film deposition processes and techniques. Noyes Publications
Schneider HG, Ickert L (1984) Halbleiterepitaxie. Dr. Alfred Hüthig Verlag
Schraft RD, Schmutz Wv, Kahlden Th (1990) Fertigen im Reinraum. Swiss Contam Control 5:7
Schumicki G, Seegebrecht P (1991) Prozeßtechnologie. Springer
Seidel H (1987) The mechanism of anisotropic silicon etching and its relevance for micromachining. Digest of the technical papers, 4th international conference on solid-state sensors and actuators (Transducers ‘87), Tokyo, S 120
Seitz D (Hrsg) (1988) Reinraumtechnik. expert-Verlag
Sherman A (1987) Chemical vapor deposition for microelectronics-pinziples. Technology and Applications. Noyes Publications
Shimbo M, Furukuwa K, Fukuda K, Tanazawa K (1986) Silicon-to-silicon direct bonding method. J Appl Phys 60:2987CrossRef
Tabelleta O, Ashai R, Sugiyama S (1990) Anisotropic etching of silicon with quaternary ammoniumhydroxide solutions. Digest of the technical papers, 9th sensor symposium, Japan, S 15
Thronton JA (1974) Influence of apparatur geometry and deposition conditions on the structure and topography of thick sputtered coatings. J Vac Sci Technol 11:666CrossRef
Turner DR (1958) Electropolishing silicon in hydrofluoric acid solutions. J Electrochem Soc 105:402CrossRef
Völklein F, Zetterer T (2006) Praxiswissen Mikrosystemtechnik: Grundlagen, Technologien, Anwendungen, 2. Aufl. Wiesbaden
Waggener HA (1970) Electrochemically controlled thinning of silicon. Bell System Tech J 59:473CrossRef
Walker MJ, Fallon M, Kissinger G, Behringer UFW, Mack CA, Stevenson T, Uttamchandani DG, Weiland LH (2001) In: SPIE Proceedings
Wallis G, Pommerantz DI (1969) Field assisted glass-metal sealing. J Appl Phys 40:3946CrossRef
Wangler N, Beck S, Ahrens, G, Voigt A, Grützner G, Müller C, Reinecke H (2012) Ultra thick epoxy-based dry-film resist for high aspect ratios. Microelectron Eng 97:92–95CrossRef
Wangler N, Gutzweiler L, Kalkandjiev K, Müller C, Mayenfels F, Reinecke H, Zengerle R, Paust N, (2011) High-resolution permanent photoresist laminate TMMF for sealed microfluidic structures in biological applications. J Micromech Microeng 21(9):95009CrossRef
Widmann D, Mader H, Friedrich H (1996) Technologie hochintegrierter Schaltungen. 2. Aufl. Springer, BerlinCrossRef
Wolf S, Tauber RN (1986) Silicon processing for the VLSI era. Process technology, Bd. 1. Lattice Press
Wu X, Ko, W H (1987) A study of compensating corner undercutting in anisotropic etching of (100) silicon. In: Digest of the technical papers, 4th international conference on solid-state sensors and actuators (Transducer ‘87), Tokyo, S 126
Metadata
Title
Mikrotechnologien
Authors
Holger Reinecke
Claas Müller
Copyright Year
2014
Publisher
Springer Berlin Heidelberg
Book
Sensortechnik

Print ISBN: 978-3-642-29941-4

Electronic ISBN: 978-3-642-29942-1

Copyright Year: 2014

DOI
https://doi.org/10.1007/978-3-642-29942-1_6