13. Montage integrierter Schaltungen

2019
OriginalPaper
Chapter

Published in:

Author: Ulrich Hilleringmann
Published in: Silizium-Halbleitertechnologie
Publisher: Springer Fachmedien Wiesbaden

Read first chapter Log in

Activate our intelligent search to find suitable subject content or patents.

search-config

AI-assisted search

Off

Zusammenfassung

Zur Einhäusung der Chips müssen die Siliziumscheiben nach der Prozessierung vorbehandelt werden. Anschließend folgen das Zerlegen der Scheiben in Chips, das Einkleben ins Gehäuse sowie die Verdrahtung der Anschlüsse von den Pads auf dem Chip zum Gehäuseanschluss. Neben den Einzeldrahtverfahren werden Komplettkontaktierungsverfahren vorgestellt.

Please log in to get access to your license.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Business + Economics & Engineering + Technology"

Online-Abonnement

Springer Professional "Business + Economics & Engineering + Technology" gives you access to:

more than 102.000 books
more than 537 journals

from the following subject areas:

Automotive
Construction + Real Estate
Business IT + Informatics
Electrical Engineering + Electronics
Energy + Sustainability
Finance + Banking
Management + Leadership
Marketing + Sales
Mechanical Engineering + Materials
Insurance + Risk

Secure your knowledge advantage now!

inform now

Springer Professional "Engineering + Technology"

Online-Abonnement

Springer Professional "Engineering + Technology" gives you access to:

more than 67.000 books
more than 390 journals

from the following specialised fileds:

Automotive
Business IT + Informatics
Construction + Real Estate
Electrical Engineering + Electronics
Energy + Sustainability
Mechanical Engineering + Materials

Secure your knowledge advantage now!

inform now

previous chapter Bipolar-Technologie

Metadata
Literature

Title: Montage integrierter Schaltungen
Author: Ulrich Hilleringmann
Publisher: Springer Fachmedien Wiesbaden
Book: Silizium-Halbleitertechnologie
Print ISBN: 978-3-658-23443-0

Electronic ISBN: 978-3-658-23444-7

Copyright Year: 2019
DOI: https://doi.org/10.1007/978-3-658-23444-7_13

This content is only visible if you are logged in and have the appropriate permissions.