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Published in: Journal of Materials Science: Materials in Electronics 18/2021

18-08-2021

Nanodiamond-filled high-temperature vulcanized silicon rubber composite for high-voltage insulator applications

Authors: Wenhao Luo, Liangjie Li, Bing Luo, Fuzeng Zhang, Tingting Wang, Yingbang Yao, Wenrong Xu

Published in: Journal of Materials Science: Materials in Electronics | Issue 18/2021

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Abstract

Nanodiamond particles with various filling ratios were added into the commercial high-temperature vulcanized silicon rubber composites, which were originally designed for high-voltage outdoor insulators. Their microstructures and electrical, thermal, mechanical, dielectric, and hydrophobic properties were systematically studied. Our results show that the nanodiamond filler improved slightly the electrical breakdown strength, i.e., from 16.2 kV/mm for the unfilled sample to 17.1 kV/mm for 0.9 vol%-filled sample, and the thermal conductivity was increased from 0.45 W/m K for the unfilled sample to 0.50 W/m K for 1.8 vol%-filled sample. Moreover, the hydrophobic properties were also improved with the contact angle at room temperature increased from 91.2° for the unfilled sample to 102.6° for the 1.8 vol%-filled sample. However, the mechanical properties were deteriorated by these fillers, i.e., decrease of the tensile strength, tear strength, etc. The dielectric constants were found to increase first with the filling fraction and then decrease. Possible mechanisms responsible for the improvement or deterioration for specific properties of the composites are discussed. Our results show that with delicate control of the filling fraction, nanodiamond fillers are helpful for the silicon rubber-based outdoor high-voltage composite insulators.

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Literature
1.
go back to reference L. Cheng, H. Mei, L. Wang, Z. Guan, F. Zhang, IEEE Trans. Dielectr. Electr. Insul. 23, 2850 (2016)CrossRef L. Cheng, H. Mei, L. Wang, Z. Guan, F. Zhang, IEEE Trans. Dielectr. Electr. Insul. 23, 2850 (2016)CrossRef
2.
go back to reference R. Chakraborty, S. Reddy, B, IEEE Trans. Dielectr. Electr. Insul. 24, 1751 (2017)CrossRef R. Chakraborty, S. Reddy, B, IEEE Trans. Dielectr. Electr. Insul. 24, 1751 (2017)CrossRef
3.
go back to reference S. Ansorge, F. Schmuch, K.O. Papailiou, IEEE Trans. Dielectr. Electr. Insul. 22, 979 (2015)CrossRef S. Ansorge, F. Schmuch, K.O. Papailiou, IEEE Trans. Dielectr. Electr. Insul. 22, 979 (2015)CrossRef
6.
go back to reference X. Yang, C. Liang, T. Ma, Y. Guo, J. Kong, J. Gu, M. Chen, J. Zhu, Adv. Compos. Hybrid Mater. 1, 207 (2018)CrossRef X. Yang, C. Liang, T. Ma, Y. Guo, J. Kong, J. Gu, M. Chen, J. Zhu, Adv. Compos. Hybrid Mater. 1, 207 (2018)CrossRef
7.
go back to reference O.D. Chimitova et al., SPIE Metamater VIII 8771, 87711A (2013) O.D. Chimitova et al., SPIE Metamater VIII 8771, 87711A (2013)
10.
go back to reference U. Kalsoom, A. Peristyy, P.N. Nesterenko, B. Paull, RSC Adv. 6, 38140 (2016)CrossRef U. Kalsoom, A. Peristyy, P.N. Nesterenko, B. Paull, RSC Adv. 6, 38140 (2016)CrossRef
11.
12.
15.
go back to reference A.M. Hezma, A. Rajeh, and Mohammed A. Mannaa. Colloid. Surface. A 581, 123821 (2019)CrossRef A.M. Hezma, A. Rajeh, and Mohammed A. Mannaa. Colloid. Surface. A 581, 123821 (2019)CrossRef
16.
17.
go back to reference X. Huang, C. Zhi, Polymer Nanocomposites: Electrical and Thermal Properties (Springer International Publishing, Switzerland, 2016), p. 285 X. Huang, C. Zhi, Polymer Nanocomposites: Electrical and Thermal Properties (Springer International Publishing, Switzerland, 2016), p. 285
18.
go back to reference S. Pacelli, R. Maloney, A.R. Chakravarti, J. Whitlow, S. Basu, S. Modaresi, S. Gehrke, A. Paul, Sci. Rep. 7, 6577 (2017)CrossRef S. Pacelli, R. Maloney, A.R. Chakravarti, J. Whitlow, S. Basu, S. Modaresi, S. Gehrke, A. Paul, Sci. Rep. 7, 6577 (2017)CrossRef
20.
go back to reference J. Neburkova, J. Vavra, P. Cigler, Curr. Opin. Solid State Mater. Sci. 21, 43 (2017)CrossRef J. Neburkova, J. Vavra, P. Cigler, Curr. Opin. Solid State Mater. Sci. 21, 43 (2017)CrossRef
21.
go back to reference A. Pentecost, S. Gour, V. Mochalin, I. Knoke, Y. Gogotsi, ACS Appl. Mater. Interf. 2, 3289 (2010)CrossRef A. Pentecost, S. Gour, V. Mochalin, I. Knoke, Y. Gogotsi, ACS Appl. Mater. Interf. 2, 3289 (2010)CrossRef
22.
go back to reference K. Turcheniuk, C. Trecazzi, C. Deeleepojananan, V.N. Mochalin, ACS Appl. Mater. Interf. 8, 25461 (2016)CrossRef K. Turcheniuk, C. Trecazzi, C. Deeleepojananan, V.N. Mochalin, ACS Appl. Mater. Interf. 8, 25461 (2016)CrossRef
23.
go back to reference A. Kausar, I. Rafique, B. Muhammad, Polym.-Plast. Technol. Eng. 56, 347 (2017)CrossRef A. Kausar, I. Rafique, B. Muhammad, Polym.-Plast. Technol. Eng. 56, 347 (2017)CrossRef
24.
go back to reference Y. Zhao, K. Lau, J. Kim, C. Xu, D. Zhao, H. Li, Compos Part B. 41, 646 (2010)CrossRef Y. Zhao, K. Lau, J. Kim, C. Xu, D. Zhao, H. Li, Compos Part B. 41, 646 (2010)CrossRef
26.
go back to reference M. Khan, A. Khurram, L. Tiehu, T. Zhao, C. Xiong, Z. Ali, N. Ali, A. Ullah, Diamond Relat. Mater. 78, 58 (2017)CrossRef M. Khan, A. Khurram, L. Tiehu, T. Zhao, C. Xiong, Z. Ali, N. Ali, A. Ullah, Diamond Relat. Mater. 78, 58 (2017)CrossRef
27.
go back to reference S. Lee, G. Kwak, Y. Hah, T. Vo, Y. Kwon, Mol. Cryst. Liq. Cryst. 651, 180 (2017)CrossRef S. Lee, G. Kwak, Y. Hah, T. Vo, Y. Kwon, Mol. Cryst. Liq. Cryst. 651, 180 (2017)CrossRef
28.
go back to reference K. Sato, Y. Tominaga, Y. Hotaa, H. Shibuya, M. Sugie, T. Saruyana, Adv. Powder Technol. 29, 972 (2018)CrossRef K. Sato, Y. Tominaga, Y. Hotaa, H. Shibuya, M. Sugie, T. Saruyana, Adv. Powder Technol. 29, 972 (2018)CrossRef
30.
go back to reference P. Liu, L. Li, L. Wang, T. Huang, Y. Yao, W. Xu, J. Alloys Compd. 774, 396 (2019)CrossRef P. Liu, L. Li, L. Wang, T. Huang, Y. Yao, W. Xu, J. Alloys Compd. 774, 396 (2019)CrossRef
31.
32.
go back to reference J.C. Arnault, H.A. Girard, Curr. Opin. Solid State Mater. Sci. 21, 10 (2017)CrossRef J.C. Arnault, H.A. Girard, Curr. Opin. Solid State Mater. Sci. 21, 10 (2017)CrossRef
34.
go back to reference Q. Wang, G. Wen, L. Liu, B. Zhu, D. Su, J. Mater. Sci. Tech. 34, 990 (2018)CrossRef Q. Wang, G. Wen, L. Liu, B. Zhu, D. Su, J. Mater. Sci. Tech. 34, 990 (2018)CrossRef
35.
go back to reference W. Li, X. Yu, K. Naito, H. Ding, X. Qu, Q. Zhang, J. Nanosci. Nanotechnol. 17, 8883 (2017)CrossRef W. Li, X. Yu, K. Naito, H. Ding, X. Qu, Q. Zhang, J. Nanosci. Nanotechnol. 17, 8883 (2017)CrossRef
36.
go back to reference H. Peng, H. Ren, M. Dang, Y. Zhang, Z. Gu, X. Yao, H. Lin, J. Mater. Sci. Mater. Electron. 30, 6680 (2019)CrossRef H. Peng, H. Ren, M. Dang, Y. Zhang, Z. Gu, X. Yao, H. Lin, J. Mater. Sci. Mater. Electron. 30, 6680 (2019)CrossRef
41.
43.
go back to reference A.M. Schrand, S.A. Ciftan Hens, O.A. Shenderova, Crit. Rev. Solid State Mater. Sci. 34, 18 (2009)CrossRef A.M. Schrand, S.A. Ciftan Hens, O.A. Shenderova, Crit. Rev. Solid State Mater. Sci. 34, 18 (2009)CrossRef
49.
go back to reference A.K. Jonscher, Dielectric Relaxation in Solids (Chelsea Dielectrics Press, 1983), pp. 224 A.K. Jonscher, Dielectric Relaxation in Solids (Chelsea Dielectrics Press, 1983), pp. 224
Metadata
Title
Nanodiamond-filled high-temperature vulcanized silicon rubber composite for high-voltage insulator applications
Authors
Wenhao Luo
Liangjie Li
Bing Luo
Fuzeng Zhang
Tingting Wang
Yingbang Yao
Wenrong Xu
Publication date
18-08-2021
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 18/2021
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-021-06794-6

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