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Published in: Microsystem Technologies 9-11/2008

01-10-2008 | Technical Paper

On the simulation of molded micro components and systems

Authors: Albert Albers, Hans-Georg Enkler, Pablo Leslabay

Published in: Microsystem Technologies | Issue 9-11/2008

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Abstract

Regarding micro components and systems, experimental work for characterizing materials’ properties as well as components’ and systems’ behaviors have to be supplemented by numerical analyses. These analyses should cover component and system issues. On a component level, macroscopic approaches are extended by methods allowing consideration of the influence of components’ grain structures including possible defects. On a system level, the high tolerances accepted for the individual components due to production inaccuracy and their effects on the expected load distribution capability of the system are taken into account. This paper presents approaches for simulation of micro components and systems using the finite element method and multi body simulation. Methods to overcome the abovementioned issues will be shown, as well as the effects of grain structure on the stress distribution in the individual components.

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Metadata
Title
On the simulation of molded micro components and systems
Authors
Albert Albers
Hans-Georg Enkler
Pablo Leslabay
Publication date
01-10-2008
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 9-11/2008
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-007-0522-y

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