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22-07-2023 | Original Article

Outstanding strength and conductivity of metallic glass composites with multiscale configuration

Authors: Wei-Zong Bao, Jie Chen, Jun-Zhi Li, Bo-Hua Yu, Chu-Yuan Liu, Ping Jiang, Zu-Jia Liu, Kai-Tao Hu, Dmitri V. Louzguine-Luzgin, Guo-Qiang Xie

Published in: Rare Metals | Issue 9/2023

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Abstract

Cu-based composites with multiscale configuration for electrical contact applications are fabricated via a ball milling (BM)-spark plasma sintering (SPS)-aging process. Synergistic strengthening of the Cu alloy matrix by micro-scale metallic glass particles and nanoscale intracrystalline precipitation phases is realized. The annealing technique achieves the decomposition of solute atoms in the Cu alloy, ensuring the excellent electrical properties of the matrix conductive network. The composite with multiscale configuration achieves an outstanding combination of ultimate compressive strength of (1114 ± 15) MPa and electrical conductivity of 33.0% ± 1.1% International Annealed Copper Standard (IACS) after annealing at 400 °C for 10.0 h. Investigation of the strengthening and conductivity mechanisms suggests that the precipitation of the Cr-rich phase within the matrix crystals is a critical contributor to the concerted enhancement of strength and conductivity. In addition, the positive role of nanocrystals precipitated at the edges of metallic glass particles on the interfacial bonding of composites is addressed.

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Title: Outstanding strength and conductivity of metallic glass composites with multiscale configuration
Authors: Wei-Zong Bao
Jie Chen
Jun-Zhi Li
Bo-Hua Yu
Chu-Yuan Liu
Ping Jiang
Zu-Jia Liu
Kai-Tao Hu
Dmitri V. Louzguine-Luzgin
Guo-Qiang Xie
Publication date: 22-07-2023
Publisher: Nonferrous Metals Society of China
Published in: Rare Metals / Issue 9/2023
Print ISSN: 1001-0521
Electronic ISSN: 1867-7185
DOI: https://doi.org/10.1007/s12598-023-02308-x

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