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Published in: Journal of Materials Science: Materials in Electronics 7/2017

08-12-2016

Preparation and characteristics of polyimide/CaMoO4 nanocomposites with enhanced dielectric performance and thermal stability

Authors: Xiuyu Wang, Tongning Chen, Mingxiu Li, Bonan Ding, Yanpeng Liu, Hao Zhang, Jianwen Liao

Published in: Journal of Materials Science: Materials in Electronics | Issue 7/2017

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Abstract

The polyimide/CaMoO4 nanocomposites were successfully prepared by ex-situ polymerization. (3-Aminopropyl) triethoxysilane (KH550) was used as coupling agent to disperse the CaMoO4 nanoparticles in polyimide matrix homogeneously. To characterize the structure and properties of the obtained nanocomposites, Scanning electron microscope, Fourier transform infrared spectroscopy, X-ray diffraction, dielectric properties and thermal stability were studied. It was observed that the CaMoO4 nanoparticles were dispersed homogeneously in the polyimide matrix without obvious aggregation. The results show that nano-sized CaMoO4 will improve dielectric constant and decrease dielectric loss of the nanocomposites in the relatively high-frequency region (>10 kHz). And the nanocomposite with excellent dielectric properties of ε = 3.04, δ = 8.0 × 10−3 was obtained after doping 2.5 wt% nano-sized CaMoO4 into polyimides. Dielectric loss of the nanocomposites is reduced in low frequency domain (<10 kHz) and enhanced in high frequency domain (>10 kHz). In addition, the thermal stability of the nanocomposites was enhanced from 544 to 651 °C compared to pure polyimide.

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Literature
1.
2.
3.
4.
go back to reference R.V. Ghorpade, C.R. Rajan, N.N. Chavan, S. Ponrathnam, eXPRESS Polym. Lett. 9, 469 (2015)CrossRef R.V. Ghorpade, C.R. Rajan, N.N. Chavan, S. Ponrathnam, eXPRESS Polym. Lett. 9, 469 (2015)CrossRef
5.
8.
go back to reference S.F. Wang, Y.R. Wang, K.C. Cheng, S.H. Chen, J. Mater. Sci. 21, 104 (2010) S.F. Wang, Y.R. Wang, K.C. Cheng, S.H. Chen, J. Mater. Sci. 21, 104 (2010)
9.
go back to reference M. Morita, Y. Kuwahara, M. Goto, J. Mater. Sci. 22, 531 (2011) M. Morita, Y. Kuwahara, M. Goto, J. Mater. Sci. 22, 531 (2011)
11.
12.
go back to reference K. Prabakaran, S. Mohanty, S.K. Nayak, J. Mater. Sci. 25, 4590 (2014) K. Prabakaran, S. Mohanty, S.K. Nayak, J. Mater. Sci. 25, 4590 (2014)
13.
go back to reference R. Barbey, L. Lavanant, D. Paripovic, N. Schüwer et al., Chem. Rev. 109, 5437 (2009)CrossRef R. Barbey, L. Lavanant, D. Paripovic, N. Schüwer et al., Chem. Rev. 109, 5437 (2009)CrossRef
14.
15.
go back to reference Y.J. Wang, X.J. Wu, C.G. Feng, Q.X. Zeng, Microelectron. Eng. 154, 17 (2016)CrossRef Y.J. Wang, X.J. Wu, C.G. Feng, Q.X. Zeng, Microelectron. Eng. 154, 17 (2016)CrossRef
16.
go back to reference Z. Demje´n, B. Puka´nszky, E. Fo¨ldes, J. Nagy, J. Colloid Interface Sci. 190, 427 (1997)CrossRef Z. Demje´n, B. Puka´nszky, E. Fo¨ldes, J. Nagy, J. Colloid Interface Sci. 190, 427 (1997)CrossRef
17.
20.
go back to reference K. Deshmukh, M.B. Ahamed, R.R. Deshmukh et al., Euro. Polym. J. 76, 14 (2016)CrossRef K. Deshmukh, M.B. Ahamed, R.R. Deshmukh et al., Euro. Polym. J. 76, 14 (2016)CrossRef
23.
go back to reference K. Deshmukh, M.B. Ahamed, K.K. Sadasivuni et al., J. Polym. Res. 23, 159 (2016)CrossRef K. Deshmukh, M.B. Ahamed, K.K. Sadasivuni et al., J. Polym. Res. 23, 159 (2016)CrossRef
24.
go back to reference K. Deshmukh, M.B. Ahamed, A.R. Polu et al., J. Mater. Sci 27, 11410 (2016) K. Deshmukh, M.B. Ahamed, A.R. Polu et al., J. Mater. Sci 27, 11410 (2016)
25.
go back to reference G.J. Papakonstantopoulos, M. Doxastakis, P.F. Nealey et al., Phys. Rev. E 75, 031803 (2007)CrossRef G.J. Papakonstantopoulos, M. Doxastakis, P.F. Nealey et al., Phys. Rev. E 75, 031803 (2007)CrossRef
30.
go back to reference M.K. Mohanapriya, K. Deshmukh, M.B. Ahamed et al., Adv. Mater. Lett. 7, 996 (2016)CrossRef M.K. Mohanapriya, K. Deshmukh, M.B. Ahamed et al., Adv. Mater. Lett. 7, 996 (2016)CrossRef
31.
33.
go back to reference K. Deshmukh, M.B. Ahamed, R.R. Deshmukh et al., Polym. Plast. Tech. Eng. 55, 231 (2016)CrossRef K. Deshmukh, M.B. Ahamed, R.R. Deshmukh et al., Polym. Plast. Tech. Eng. 55, 231 (2016)CrossRef
34.
go back to reference K. Deshmukh, M.B. Ahamed, R.R. Deshmukh et al., Polym. Plast. Tech. Eng. 55, 1240 (2016)CrossRef K. Deshmukh, M.B. Ahamed, R.R. Deshmukh et al., Polym. Plast. Tech. Eng. 55, 1240 (2016)CrossRef
Metadata
Title
Preparation and characteristics of polyimide/CaMoO4 nanocomposites with enhanced dielectric performance and thermal stability
Authors
Xiuyu Wang
Tongning Chen
Mingxiu Li
Bonan Ding
Yanpeng Liu
Hao Zhang
Jianwen Liao
Publication date
08-12-2016
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 7/2017
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-016-6178-6

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