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Published in: Journal of Materials Science: Materials in Electronics 12/2012

01-12-2012

Preparation and dielectric properties of surface modified TiO2/PEN composite films with high thermal stability and flexibility

Authors: Xu Huang, Zejun Pu, Lifen Tong, Zicheng Wang, Xiaobo Liu

Published in: Journal of Materials Science: Materials in Electronics | Issue 12/2012

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Abstract

A series of surface modified titanium dioxide (TiO2)/polyarylene ether nitriles (PEN) composite films with different modified TiO2 contents were prepared by solution casting method combined with ultrasonic dispersion technology. TiO2 particles were successfully surface modified by PEN–COOH polymer previously, which was confirmed by transmission electron microscopy, Fourier transform infrared spectroscopy and thermogravimetric analysis. Besides, SEM images of composite films revealed that the interfacial adhesion between surface modified TiO2 particles and the PEN matrix was effectively improved because of their common cyano groups and similar structure units. Furthermore, thermal, mechanical and dielectric characterizations showed that the composite films possess excellent thermal properties and flexibility as well as good dielectric properties, their glass transition temperatures were as high as 223 °C and the initial decomposition temperatures were all above 480 °C. In addition, it was found that the tensile strength of modified TiO2/PEN composites was better than raw TiO2/PEN composites. More importantly, the dielectric constant of composite films increases linearly with increment of the surface modified TiO2 particles content. When the mass fraction of modified TiO2 particles reached 40 %, the dielectric constant of the composite film increased to 7.9 (1 kHz), while the dielectric loss is just 0.028 (1 kHz).

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Metadata
Title
Preparation and dielectric properties of surface modified TiO2/PEN composite films with high thermal stability and flexibility
Authors
Xu Huang
Zejun Pu
Lifen Tong
Zicheng Wang
Xiaobo Liu
Publication date
01-12-2012
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 12/2012
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-012-0919-y

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