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Microsystem Technologies
Published in: Microsystem Technologies 3/2017

30-11-2015 | Technical Paper

Sandwich structure based on back-side etching silicon (100) wafers for flexible electronic technology

Authors: Yong-hua Zhang, Stephen A. Campbell, Liyuan Zhang, Sreejith Karthikeyan

Published in: Microsystem Technologies | Issue 3/2017

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Abstract

An SU-8-silicon(100)-SU-8 flexible composite sandwich structure is studied. Besides preventing corrosion to the thin silicon membrane, SU-8 photoresist coated on the silicon membrane improves its flexibility as shown by an ANSYS finite element simulation. Using a plasma enhanced chemical vapor deposited SiO2/Si3N4 composite film as an etch mask on the polished side, a 4″ (100) silicon wafer was thinned to 26 µm without rupture in a 30 wt% KOH solution. The wafer was coated on both sides with 20 µm of SU-8 photoresist and then bent over cylinders with various diameters, to flex the sandwich in a controlled manner. The determined minimal bending radius of the fabricated thin silicon-based sandwich structure is approximately 3.5 mm. The fabrication of this sandwich structure is compatible with conventional microelectronic fabrication processing. Thus, it allows one to thin fully fabricated devices in a post-fabrication process to make high-performance flexible electronics.
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Metadata
Title
Sandwich structure based on back-side etching silicon (100) wafers for flexible electronic technology
Authors
Yong-hua Zhang
Stephen A. Campbell
Liyuan Zhang
Sreejith Karthikeyan
Publication date
30-11-2015
Publisher
Springer Berlin Heidelberg
Published in
Microsystem Technologies / Issue 3/2017
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-015-2737-7

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