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Published in: Journal of Materials Science: Materials in Electronics 10/2014

01-10-2014

Selenization of electrodeposited copper–indium alloy thin films for solar cell applications

Authors: Priyanka U. Londhe, Ashwini B. Rohom, Nandu B. Chaure

Published in: Journal of Materials Science: Materials in Electronics | Issue 10/2014

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Abstract

Copper–Indium (Cu–In) alloys with sulfur and selenium have technological importance in the development of thin film solar cell technology. We have used potentiostatic electrochemical technique with three-electrode geometry for the deposition of Cu–In alloy thin films in an aqueous electrolyte. Cathodic voltammetry (CV) was thoroughly studied to optimize the electrodeposition parameters. The deposition potential for Cu–In alloy was found to be in the range −0.70 to −0.85 V versus Ag/AgCl reference electrode. Polycrystalline CuxIny thin films were electrodeposited from aqueous bath at room temperature and 45 °C. Effect of concentration of citric acid was extensively studied by CV measurements. The as-deposited Cu–In films were characterized with a range of characterization techniques to study the structural, morphological, compositional and electrical properties. Thin layers of Cu–In were selenized in a homemade tubular furnace at 400 °C, which reveals the formation of polycrystalline CuInSe2 (CISe) thin films with tetragonal structure. The band gap of CISe thin film was estimated ~1.05 eV by optical absorption spectroscopy. Nearly stoichiometric CISe thin film, Cu = 25.25 %, In = 26.48 % and Se = 48.27 % was obtained after selenization. The linear behavior of current density–voltage (J–V) was observed for Cu–In alloy thin films whereas, the selenized Cu–In alloy films (CISe) possess rectifying properties.

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Metadata
Title
Selenization of electrodeposited copper–indium alloy thin films for solar cell applications
Authors
Priyanka U. Londhe
Ashwini B. Rohom
Nandu B. Chaure
Publication date
01-10-2014
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 10/2014
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2217-3

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