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Journal of Materials Science: Materials in Electronics

Published in:

08-05-2019

Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications

Authors: Hwan-Pil Park, Gwancheol Seo, Sungcheol Kim, Key-one Ahn, Young-Ho Kim

Published in: Journal of Materials Science: Materials in Electronics | Issue 11/2019

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Abstract

Shear strength between Sn–3.0Ag–0.5Cu (SAC) solders and Cu/Ti in under bump metallization (UBM) samples aged using two solid-state aging processes was investigated. One method aged the samples at 200 °C for up for five 1-h intervals; the other aged the samples at 200 °C continuously for up to 5 h in a convection oven. After reflow, all samples showed scallop-shaped Cu₆Sn₅ intermetallic compounds (IMCs) at the interfaces between SAC solder and Cu substrate. After aging, the Cu layers of all samples were gradually depleted, and lump-shaped Cu₆Sn₅ was observed to be separated from the SAC/Cu interfaces. The shear strength of all samples was gradually decreased with increased aging due to depletion of the Cu wetting layer, formation of IMCs with solder, and separation of the IMCs from the interfaces during aging. Quantitative analysis revealed that exposed Ti area is an effective predictor of decrease in shear strength generated by the spalling phenomenon.

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Title: Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications
Authors: Hwan-Pil Park
Gwancheol Seo
Sungcheol Kim
Key-one Ahn
Young-Ho Kim
Publication date: 08-05-2019
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 11/2019
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-019-01399-6

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