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Published in: Journal of Materials Science: Materials in Electronics 18/2019

30-08-2019

Solution-produced copper iodide thin films for photosensor and for vertical thermoelectric nanogenerator, which uses a spontaneous temperature gradient

Authors: N. P. Klochko, K. S. Klepikova, V. R. Kopach, D. O. Zhadan, V. V. Starikov, D. S. Sofronov, I. V. Khrypunova, S. I. Petrushenko, S. V. Dukarov, V. M. Lyubov, M. V. Kirichenko, S. P. Bigas, A. L. Khrypunova

Published in: Journal of Materials Science: Materials in Electronics | Issue 18/2019

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Abstract

The article presents a new design of vertical thermoelectric nanogenerator (TENG) on the base of thin-film CuI/FTO composition with ohmic Cr/Cu contacts, which combines the functions of UV–Visible photosensor. Its functioning as the TENG carried out due to the spontaneous temperature gradient approximately 7 K, which occurs under the uniform heating of the entire device at temperature 30 °C. The open circuit voltage of TENG test sample is Voc = 0.09 mV and maximum output power is Pmax = 0.4 nW at temperature 50 °C. UV–Visible photosensor based on Cu/Cr/CuI/FTO/Cr/Cu composition possess high values of photocurrents Iph under illumination, which eliminates necessity of amplification of the photosensor signal. The photoresponse and reset times of the photosensor are τp ≈ 30–100 s and τr ≈ 20–100 s, respectively. The explanation of the possibility of using CuI thin films, solution-produced by the affordable successive ionic layer adsorption and reaction (SILAR) method as both thermoelectric and photosensitive material is based on the studying of surface morphology, crystal structure, chemical composition and optical properties.

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Literature
1.
go back to reference Y. Yang, K.C. Pradel, Q. Jing, J.M. Wu, F. Zhang, Y. Zhou, Y. Zhang, Z.L. Wang, ACS Nano 6(8), 6984 (2012)CrossRef Y. Yang, K.C. Pradel, Q. Jing, J.M. Wu, F. Zhang, Y. Zhou, Y. Zhang, Z.L. Wang, ACS Nano 6(8), 6984 (2012)CrossRef
2.
go back to reference D. Tainoff, A. Proudhom, C. Tur, T. Crozes, S. Dufresnes, S. Dumont, D. Bourgault, O. Bourgeois, Nano Energy 57, 804 (2019)CrossRef D. Tainoff, A. Proudhom, C. Tur, T. Crozes, S. Dufresnes, S. Dumont, D. Bourgault, O. Bourgeois, Nano Energy 57, 804 (2019)CrossRef
3.
go back to reference M. He, Y.-J. Lin, C.-M. Chiu, W. Yang, B. Zhang, D. Yun, Z.-H. Lin, Nano Energy 49, 588 (2018)CrossRef M. He, Y.-J. Lin, C.-M. Chiu, W. Yang, B. Zhang, D. Yun, Z.-H. Lin, Nano Energy 49, 588 (2018)CrossRef
4.
go back to reference M. Norouzi, M. Kolahdouz, P. Ebrahimi, M. Ganjian, R. Soleimanzadeh, K. Narimani, H. Radamson, Thin Solid Films 619, 41 (2016)CrossRef M. Norouzi, M. Kolahdouz, P. Ebrahimi, M. Ganjian, R. Soleimanzadeh, K. Narimani, H. Radamson, Thin Solid Films 619, 41 (2016)CrossRef
5.
go back to reference T. Zhan, R. Yamato, S. Hashimoto, M. Tomita, S. Oba, Y. Himeda, K. Mesaki, H. Takezawa, R. Yokogawa, Y. Xu, T. Matsukawa, A. Ogura, Y. Kamakura, T. Watanabe, Sci. Technol. Adv. Mater. 19(1), 443 (2018)CrossRef T. Zhan, R. Yamato, S. Hashimoto, M. Tomita, S. Oba, Y. Himeda, K. Mesaki, H. Takezawa, R. Yokogawa, Y. Xu, T. Matsukawa, A. Ogura, Y. Kamakura, T. Watanabe, Sci. Technol. Adv. Mater. 19(1), 443 (2018)CrossRef
6.
go back to reference J.P. Rojas, D. Conchouso, A. Arevalo, D. Singh, I.G. Foulds, M.M. Hussain, Nano Energy 31, 296 (2017)CrossRef J.P. Rojas, D. Conchouso, A. Arevalo, D. Singh, I.G. Foulds, M.M. Hussain, Nano Energy 31, 296 (2017)CrossRef
7.
go back to reference Y. Xie, T.-M. Chou, W. Yang, M. He, Y. Zhao, N. Li, Z.-H. Lin, Semicond. Sci. Technol. 32(4), 044003 (2017)CrossRef Y. Xie, T.-M. Chou, W. Yang, M. He, Y. Zhao, N. Li, Z.-H. Lin, Semicond. Sci. Technol. 32(4), 044003 (2017)CrossRef
8.
go back to reference Y. Wu, S. Kuang, H. Li, H. Wang, R. Yang, Y. Zhai, G. Zhu, Z.L. Wang, Adv. Mater. Technol. 3, 1800166 (2018)CrossRef Y. Wu, S. Kuang, H. Li, H. Wang, R. Yang, Y. Zhai, G. Zhu, Z.L. Wang, Adv. Mater. Technol. 3, 1800166 (2018)CrossRef
9.
go back to reference N.P. Klochko, K.S. Klepikova, V.R. Kopach, I.I. Tyukhov, V.V. Starikov, D.S. Sofronov, I.V. Khrypunova, D.O. Zhadan, S.I. Petrushenko, S.V. Dukarov, V.M. Lyubov, M.V. Kirichenko, A.L. Khrypunova, Sol. Energy 184, 230 (2019)CrossRef N.P. Klochko, K.S. Klepikova, V.R. Kopach, I.I. Tyukhov, V.V. Starikov, D.S. Sofronov, I.V. Khrypunova, D.O. Zhadan, S.I. Petrushenko, S.V. Dukarov, V.M. Lyubov, M.V. Kirichenko, A.L. Khrypunova, Sol. Energy 184, 230 (2019)CrossRef
10.
go back to reference C. Yang, D. Souchay, M. Kneiβ, M. Bogner, H.M. Wei, M. Lorenz, O. Oeckler, G. Benstetter, Y.Q. Fu, M. Grundmann, Nature Commun. 8, 16076 (2017)CrossRef C. Yang, D. Souchay, M. Kneiβ, M. Bogner, H.M. Wei, M. Lorenz, O. Oeckler, G. Benstetter, Y.Q. Fu, M. Grundmann, Nature Commun. 8, 16076 (2017)CrossRef
11.
go back to reference T. Ishibe, A. Tomeda, K. Watanabe, Y. Nakamura, IOP Conf. J. Phys. 1052, 012126 (2018)CrossRef T. Ishibe, A. Tomeda, K. Watanabe, Y. Nakamura, IOP Conf. J. Phys. 1052, 012126 (2018)CrossRef
12.
go back to reference B.M.M. Faustino, D. Gomes, J. Faria, T. Juntunen, G. Gaspar, C. Bianchi, A. Almeida, A. Marques, I. Tittonen, I. Ferreira, Sci. Rep. 8, 6867 (2018)CrossRef B.M.M. Faustino, D. Gomes, J. Faria, T. Juntunen, G. Gaspar, C. Bianchi, A. Almeida, A. Marques, I. Tittonen, I. Ferreira, Sci. Rep. 8, 6867 (2018)CrossRef
13.
15.
go back to reference N.P. Klochko, V.R. Kopach, I.I. Tyukhov, G.S. Khrypunov, V.E. Korsun, V.O. Nikitin, V.M. Lyubov, M.V. Kirichenko, O.N. Otchenashko, D.O. Zhadan, M.O. Maslak, A.L. Khrypunova, Sol. Energy 157, 657 (2017)CrossRef N.P. Klochko, V.R. Kopach, I.I. Tyukhov, G.S. Khrypunov, V.E. Korsun, V.O. Nikitin, V.M. Lyubov, M.V. Kirichenko, O.N. Otchenashko, D.O. Zhadan, M.O. Maslak, A.L. Khrypunova, Sol. Energy 157, 657 (2017)CrossRef
16.
go back to reference N.P. Klochko, K.S. Klepikova, V.R. Kopach, I.I. Tyukhov, D.O. Zhadan, G.S. Khrypunov, S.I. Petrushenko, S.V. Dukarov, V.M. Lyubov, M.V. Kirichenko, A.L. Khrypunova, Sol. Energy 171, 704 (2018)CrossRef N.P. Klochko, K.S. Klepikova, V.R. Kopach, I.I. Tyukhov, D.O. Zhadan, G.S. Khrypunov, S.I. Petrushenko, S.V. Dukarov, V.M. Lyubov, M.V. Kirichenko, A.L. Khrypunova, Sol. Energy 171, 704 (2018)CrossRef
17.
go back to reference B.D. Viezbicke, S. Patel, B.E. Davis, D.P. Birnie, Phys. Status Solidi (B) 252(8), 1700 (2015)CrossRef B.D. Viezbicke, S. Patel, B.E. Davis, D.P. Birnie, Phys. Status Solidi (B) 252(8), 1700 (2015)CrossRef
18.
go back to reference Amalina MN, Rusop M (2011) IEEE Student Conference on Research and Development. Cyberjaya, Malaysia. 10.1109/SCOReD.2011.6148761 Amalina MN, Rusop M (2011) IEEE Student Conference on Research and Development. Cyberjaya, Malaysia. 10.1109/SCOReD.2011.6148761
19.
go back to reference M. Dongol, A. El-Denglawey, M.S. Abd El Sadek, I.S. Yahia, Optik 126, 1352 (2015)CrossRef M. Dongol, A. El-Denglawey, M.S. Abd El Sadek, I.S. Yahia, Optik 126, 1352 (2015)CrossRef
20.
go back to reference V.R. Kopach, K.S. Klepikova, N.P. Klochko, I.I. Tyukhov, G.S. Khrypunov, V.E. Korsun, V.M. Lyubov, A.V. Kopach, R.V. Zaitsev, M.V. Kirichenko, Sol. Energy 136, 23 (2016)CrossRef V.R. Kopach, K.S. Klepikova, N.P. Klochko, I.I. Tyukhov, G.S. Khrypunov, V.E. Korsun, V.M. Lyubov, A.V. Kopach, R.V. Zaitsev, M.V. Kirichenko, Sol. Energy 136, 23 (2016)CrossRef
22.
go back to reference G. Lin, F. Zhao, Y. Zhao, D. Zhang, L. Yang, X. Xue, X. Wang, C. Qu, Q. Li, L. Zhang, Materials 9, 990 (2016)CrossRef G. Lin, F. Zhao, Y. Zhao, D. Zhang, L. Yang, X. Xue, X. Wang, C. Qu, Q. Li, L. Zhang, Materials 9, 990 (2016)CrossRef
23.
go back to reference M. Kneiß, C. Yang, J. Barzola-Quiquia, G. Benndorf, H. von Wenckstern, P. Esquinazi, M. Lorenz, M. Grundmann, Adv. Mater. Interfaces 5(6), 1701411 (2018)CrossRef M. Kneiß, C. Yang, J. Barzola-Quiquia, G. Benndorf, H. von Wenckstern, P. Esquinazi, M. Lorenz, M. Grundmann, Adv. Mater. Interfaces 5(6), 1701411 (2018)CrossRef
24.
go back to reference M. Grundmann, F.-L. Schein, M. Lorenz, T. Böntgen, J. Lenzner, H. Wenckstern, Phys. Status Solidi A 210, 1671 (2013)CrossRef M. Grundmann, F.-L. Schein, M. Lorenz, T. Böntgen, J. Lenzner, H. Wenckstern, Phys. Status Solidi A 210, 1671 (2013)CrossRef
26.
go back to reference H.R. Humud, S. Hussein, Int. J. Chem.Tech. Res. 10(9), 1109 (2017) H.R. Humud, S. Hussein, Int. J. Chem.Tech. Res. 10(9), 1109 (2017)
27.
go back to reference M.R. Johan, K. Si-Wen, N. Hawari, N.A.K. Aznan, Int. J. Electrochem. Sci. 7, 4942 (2012) M.R. Johan, K. Si-Wen, N. Hawari, N.A.K. Aznan, Int. J. Electrochem. Sci. 7, 4942 (2012)
Metadata
Title
Solution-produced copper iodide thin films for photosensor and for vertical thermoelectric nanogenerator, which uses a spontaneous temperature gradient
Authors
N. P. Klochko
K. S. Klepikova
V. R. Kopach
D. O. Zhadan
V. V. Starikov
D. S. Sofronov
I. V. Khrypunova
S. I. Petrushenko
S. V. Dukarov
V. M. Lyubov
M. V. Kirichenko
S. P. Bigas
A. L. Khrypunova
Publication date
30-08-2019
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 18/2019
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-02103-4

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