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Published in: Journal of Materials Science: Materials in Electronics 9/2014

01-09-2014

Stress relaxation behavior and low cycle fatigue behavior of bulk SAC 305

Authors: Gary Paradee, Eric Bailey, Aris Christou

Published in: Journal of Materials Science: Materials in Electronics | Issue 9/2014

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Abstract

Bulk Sn96.5Ag3Cu0.5 samples were mechanically tested to investigate the effect of temperature, frequency and applied stress on the low cycle fatigue and stress relaxation behavior and the corresponding microstructure. Samples were tested under a variety of parameters including applied stresses between 8 and 80 MPa, temperatures of 25, 50, 100 and 150 °C and frequencies of 1, 0.1 and 0.01 Hz, respectively. Samples used for the stress relaxation behavior exhibited plastic behavior with increased softening behavior with increased stress levels, increased temperature and lower frequencies. Bayesian analysis revealed that stress relaxation behavior could be expressed in general by the following expression: ∆σ = AN B In the previous expression, Bayesian analysis showed that the testing frequency has an exponential dependency while the temperature has a power law dependency on the parameters A and b. The results of the low cycle fatigue study showed that life decreased with increased applied stress, decreased frequency and increased temperature. Bayesian analysis revealed that the low cycle fatigue behavior could be described by the following expression: ∆σ = G(logN) m . Additionally, Bayesian analysis showed that the testing frequency and temperature both have a power law dependency on the parameters G and m.

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Metadata
Title
Stress relaxation behavior and low cycle fatigue behavior of bulk SAC 305
Authors
Gary Paradee
Eric Bailey
Aris Christou
Publication date
01-09-2014
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 9/2014
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2138-1

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