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Published in:
01-07-2010
Synthesis of silver nanorods and application for die attach material in devices
Published in: Journal of Materials Science: Materials in Electronics | Issue 7/2010
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Abstract
Silver nanorods have been successfully synthesized in high yield by a polyol process in the presence of FeCl3. The yield and morphology of the silver particles from these conditions were dependant on the concentration of FeCl3, and the molar ratio of the capping agent to AgNO3. The optimized conditions for the synthesis of the nanorods were: 20 μM of FeCl3 and a molar ratio of 1.8:1 of capping agent to AgNO3. The nanorods produced were used to form a silver layer at 400 °C with a low electrical resistivity of 6.1 × 10−6 Ω cm. The silver layer was applied as die-attachment films to connect a SiC chip to a copper substrate. This formed a porous structure, which was evaluated for structure and strength.