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Journal of Electronic Materials
Published in: Journal of Electronic Materials 12/2009

01-12-2009

TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface

Authors: P. J. Shang, Z. Q. Liu, D. X. Li, J. K. Shang

Published in: Journal of Electronic Materials | Issue 12/2009

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previous article Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders
next article The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects

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Metadata
Title
TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface
Authors
P. J. Shang
Z. Q. Liu
D. X. Li
J. K. Shang
Publication date
01-12-2009
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 12/2009
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-009-0894-0

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Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation

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Interfacial Adhesion Characteristics Between Electroless-Plated Ni and Polyimide Films Modified by Alkali Surface Pretreatment

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Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages

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Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders