Skip to main content
Top
Published in: Journal of Materials Science: Materials in Electronics 14/2018

12-05-2018

Tens of micron-thick, crack-free yttrium iron garnet films on a Gd3Ga5O12 substrate based on the layer by layer growth method

Authors: Hui Zheng, Peng Zheng, Qiong Wu, Jiangxia Deng, Zhihua Ying, Xiaokun Niu, Liang Zheng

Published in: Journal of Materials Science: Materials in Electronics | Issue 14/2018

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

In this paper, the maximum thickness of crack-free yttrium-iron-garnet ferrite film was increased from 7 to 13 µm by layer by layer growth method. Also, the effect of a layer by layer growth method on films morphology, crystal structure and magnetic properties were investigated. X-ray diffraction θ–2θ revealed the orientation of crystal structure could be increased by the layer-by-layer growth method. Scanning electron microscopy and stylus profiler measurement showed the roughness and morphology of film surface were improved efficiently after using the layer-by-layer growth method. Magnetic hysteresis loops and FMR spectrum representing this layer-by-layer growth method could efficiently increase film magnetism and decrease FMR linewidth. Consequently, this innovative method of layer-by-layer growth efficiently provides a pathway to prepare excellent properties, tens of micron-thick, crack-free yttrium iron garnet films and creates unique significance in the electronics industry.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Literature
1.
go back to reference M. Lang, M. Montazeri, M.C. Onbasli, X. Kou et al., Nano Lett. 14, 3459 (2014)CrossRef M. Lang, M. Montazeri, M.C. Onbasli, X. Kou et al., Nano Lett. 14, 3459 (2014)CrossRef
2.
go back to reference F.F.W.A. Wan, H.H. Jaafar, M.F. Ain, N.S. Abdullah, Z.A. Ahmad, J. Mater. Sci. Mater. Electron. 26(1), 1–11 (2014) F.F.W.A. Wan, H.H. Jaafar, M.F. Ain, N.S. Abdullah, Z.A. Ahmad, J. Mater. Sci. Mater. Electron. 26(1), 1–11 (2014)
3.
go back to reference K. Ando, S. Watanabe, S. Mooser, E. Saitoh, H. Sirringhaus, Nat. Mater. 12, 622 (2013)CrossRef K. Ando, S. Watanabe, S. Mooser, E. Saitoh, H. Sirringhaus, Nat. Mater. 12, 622 (2013)CrossRef
4.
5.
go back to reference A.N. Hapishah, M. Hashim, M.M. Syazwan, I.R. Idza, N. Rodziah, J. Mater. Sci. Mater. Electron. 1–9 (2017) A.N. Hapishah, M. Hashim, M.M. Syazwan, I.R. Idza, N. Rodziah, J. Mater. Sci. Mater. Electron. 1–9 (2017)
6.
go back to reference I.V. Zavislyak, V.P. Sohatsky, M.A. Popov, G. Srinivasan, Phys. Rev. 87, 7 (2013)CrossRef I.V. Zavislyak, V.P. Sohatsky, M.A. Popov, G. Srinivasan, Phys. Rev. 87, 7 (2013)CrossRef
9.
go back to reference J.D. Bierlein, L.W. Hinderks, P.M. Richards, J. Appl. Phys. 38, 1232–1233 (1967)CrossRef J.D. Bierlein, L.W. Hinderks, P.M. Richards, J. Appl. Phys. 38, 1232–1233 (1967)CrossRef
10.
go back to reference H. Zheng, J.J. Zhou, J.X. Deng, P. Zheng et al., Mater. Lett. 123, 181 (2014)CrossRef H. Zheng, J.J. Zhou, J.X. Deng, P. Zheng et al., Mater. Lett. 123, 181 (2014)CrossRef
11.
go back to reference V.G. Harris, A. Geiler, Y. Chen et al., J. Magn. Magn. Mater. 321, 2035 (2009)CrossRef V.G. Harris, A. Geiler, Y. Chen et al., J. Magn. Magn. Mater. 321, 2035 (2009)CrossRef
12.
14.
go back to reference I.I. Syvorotka, I.M. Syvorotka, S.B. Ubizskii, Solid State Phenom. 200, 250 (2013)CrossRef I.I. Syvorotka, I.M. Syvorotka, S.B. Ubizskii, Solid State Phenom. 200, 250 (2013)CrossRef
22.
go back to reference H. Zheng, P. Zheng, Q. Feng, J. Deng, Z. Ying, L. Zheng, Mater. Lett. 218, 241 (2018)CrossRef H. Zheng, P. Zheng, Q. Feng, J. Deng, Z. Ying, L. Zheng, Mater. Lett. 218, 241 (2018)CrossRef
23.
24.
go back to reference Y. Krochenberger, K.S. Yun, T. Hatano et al., J. Appl. Phys. 106, 123911 (2009)CrossRef Y. Krochenberger, K.S. Yun, T. Hatano et al., J. Appl. Phys. 106, 123911 (2009)CrossRef
28.
29.
go back to reference E. Popova, N. Keller, F. Gendron et al., J. Vac. Sci. Technol. 19, 2567 (2001)CrossRef E. Popova, N. Keller, F. Gendron et al., J. Vac. Sci. Technol. 19, 2567 (2001)CrossRef
30.
31.
go back to reference D. Venkateswarlu, K.G. Padmalekha, S.V. Bhat, P.S.A. Kumar, IEEE Trans. Magn. 49, 3097 (2013)CrossRef D. Venkateswarlu, K.G. Padmalekha, S.V. Bhat, P.S.A. Kumar, IEEE Trans. Magn. 49, 3097 (2013)CrossRef
Metadata
Title
Tens of micron-thick, crack-free yttrium iron garnet films on a Gd3Ga5O12 substrate based on the layer by layer growth method
Authors
Hui Zheng
Peng Zheng
Qiong Wu
Jiangxia Deng
Zhihua Ying
Xiaokun Niu
Liang Zheng
Publication date
12-05-2018
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 14/2018
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-9278-7

Other articles of this Issue 14/2018

Journal of Materials Science: Materials in Electronics 14/2018 Go to the issue