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Polymer Science, Series D

Published in:

01-09-2022

The Influence of Silver Powder Filler on the Curing Process and Structure of Conducting Adhesives

Authors: A. I. Gulyaev, K. L. Besednov, A. P. Petrova, N. V. Antyufeeva

Published in: Polymer Science, Series D | Issue 3/2022

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Abstract

The influence of silver powder filler on the process of curing of an adhesive composition was researched. The formation of the microstructure of epoxy adhesive compositions filled with silver cured at temperatures of 175 and 200°C was studied. When increasing the curing temperature to 200°C indicators of recrystallization of silver filler were revealed, as well as an increase in electric conductivity of the adhesive layer; at the same time, the shear strength of the adhesive bond did not change.

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Title: The Influence of Silver Powder Filler on the Curing Process and Structure of Conducting Adhesives
Authors: A. I. Gulyaev
K. L. Besednov
A. P. Petrova
N. V. Antyufeeva
Publication date: 01-09-2022
Publisher: Pleiades Publishing
Published in: Polymer Science, Series D / Issue 3/2022
Print ISSN: 1995-4212
Electronic ISSN: 1995-4220
DOI: https://doi.org/10.1134/S1995421222030091

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