Skip to main content
Erschienen in: Polymer Science, Series D 3/2022

01.09.2022

The Influence of Silver Powder Filler on the Curing Process and Structure of Conducting Adhesives

verfasst von: A. I. Gulyaev, K. L. Besednov, A. P. Petrova, N. V. Antyufeeva

Erschienen in: Polymer Science, Series D | Ausgabe 3/2022

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

The influence of silver powder filler on the process of curing of an adhesive composition was researched. The formation of the microstructure of epoxy adhesive compositions filled with silver cured at temperatures of 175 and 200°C was studied. When increasing the curing temperature to 200°C indicators of recrystallization of silver filler were revealed, as well as an increase in electric conductivity of the adhesive layer; at the same time, the shear strength of the adhesive bond did not change.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
1.
Zurück zum Zitat E. N. Kablov, “Innovative developments of the Russian State Research Center VIAM for the implementation of the Strategic Directions for the Development of Materials and Technologies for Their Processing to 2030,” Aviats. Mater. Tekhnolog., No. 1, 3–33 (2015). E. N. Kablov, “Innovative developments of the Russian State Research Center VIAM for the implementation of the Strategic Directions for the Development of Materials and Technologies for Their Processing to 2030,” Aviats. Mater. Tekhnolog., No. 1, 3–33 (2015).
2.
Zurück zum Zitat P. V. Shershak, N. O. Yakovlev, G. I. Shokin, K. E. Kutsevich, and E. A. Popkova, “An estimation method and the factors affecting quality of gluing of the skin with a cellular filler in the structures of aircraft floor and cabin,” Aviats. Mater. Tekhnolog., No. 2, 74–80 (2020). P. V. Shershak, N. O. Yakovlev, G. I. Shokin, K. E. Kutsevich, and E. A. Popkova, “An estimation method and the factors affecting quality of gluing of the skin with a cellular filler in the structures of aircraft floor and cabin,” Aviats. Mater. Tekhnolog., No. 2, 74–80 (2020).
3.
Zurück zum Zitat A. P. Petrova, N. F. Lukina, and A. Yu. Isaev, “Workability of glued junction on the basis of epoxy film glues under the concurrent effect of loads and climatic factors,” Trudy VIAM: Elektron. Nauch.-Tekhn. Zh., No. 9, 6 (2019). A. P. Petrova, N. F. Lukina, and A. Yu. Isaev, “Workability of glued junction on the basis of epoxy film glues under the concurrent effect of loads and climatic factors,” Trudy VIAM: Elektron. Nauch.-Tekhn. Zh., No. 9, 6 (2019).
4.
Zurück zum Zitat A. A. Barannikov, V. I. Postnov, E. A. Veshkin, and I. V. Starostina, “Relationship between energy characteristics of the surface of fiber glass grade VPS-53K with the strength of the glued junction on its basis,” Trudy VIAM: Elektron. Nauch.-Tekhn. Zh., No. 10, 5 (2020). A. A. Barannikov, V. I. Postnov, E. A. Veshkin, and I. V. Starostina, “Relationship between energy characteristics of the surface of fiber glass grade VPS-53K with the strength of the glued junction on its basis,” Trudy VIAM: Elektron. Nauch.-Tekhn. Zh., No. 10, 5 (2020).
5.
Zurück zum Zitat E. N. Kablov, L. V. Chursova, N. F. Lukina, K. E. Ku-tsevich, E. V. Rubtsova, and A. P. Petrova, “A study of epoxide–polysulfone polymer systems for high-strength adhesives of aviation purpose,” Polym. Sci., Ser. D 10, 225–229 (2017). E. N. Kablov, L. V. Chursova, N. F. Lukina, K. E. Ku-tsevich, E. V. Rubtsova, and A. P. Petrova, “A study of epoxide–polysulfone polymer systems for high-strength adhesives of aviation purpose,” Polym. Sci., Ser. D 10, 225–229 (2017).
6.
Zurück zum Zitat G. V. Malysheva, D. V. Grashchenkov, and T. A. Guzeva, “Estimation of the workability of using glues and adhesive prepregs in the production of three-layer panels,” Aviats. Mater. Tekhnolog., No. 4, 26–30 (2018). G. V. Malysheva, D. V. Grashchenkov, and T. A. Guzeva, “Estimation of the workability of using glues and adhesive prepregs in the production of three-layer panels,” Aviats. Mater. Tekhnolog., No. 4, 26–30 (2018).
7.
Zurück zum Zitat E. N. Kablov, V. A. Sagomonova, A. E. Sorokin, V. V. Tselikin, and A. I. Gulyaev, “Studies of the structure and properties of a polymer composite material with an integrated vibration absorbing layer,” Vse Materialy. Entsiklopedicheskii Spravochnik, No. 3, 2–9 (2020). E. N. Kablov, V. A. Sagomonova, A. E. Sorokin, V. V. Tselikin, and A. I. Gulyaev, “Studies of the structure and properties of a polymer composite material with an integrated vibration absorbing layer,” Vse Materialy. Entsiklopedicheskii Spravochnik, No. 3, 2–9 (2020).
8.
Zurück zum Zitat V. E. Gul’ and and L. Z. Shenfil’, Conducting Polymeric Compositions (Khimiya, Moscow, 1984). V. E. Gul’ and and L. Z. Shenfil’, Conducting Polymeric Compositions (Khimiya, Moscow, 1984).
9.
Zurück zum Zitat A. P. Petrova, A. Yu. Isaev, N. F. Lukina, and B. F. Pavlyuk, “Effect of fillers on electric conductivity of glues and properties of conductive glues. A review,” Klei. Germetiki. Tekhnologii, No. 8, 9–15 (2018). A. P. Petrova, A. Yu. Isaev, N. F. Lukina, and B. F. Pavlyuk, “Effect of fillers on electric conductivity of glues and properties of conductive glues. A review,” Klei. Germetiki. Tekhnologii, No. 8, 9–15 (2018).
10.
Zurück zum Zitat Yu. S. Ranzhin, Yu. N. Kalashnikov, and N. P. Litvinenko, “Conducting Glue for Automatic Assembly of Open Crystals,” in Proceedings of All-Russian Conference of UHF Electronics and Microelectronics (LETI, St. Petersburg, 2016), Vol. 2. Yu. S. Ranzhin, Yu. N. Kalashnikov, and N. P. Litvinenko, “Conducting Glue for Automatic Assembly of Open Crystals,” in Proceedings of All-Russian Conference of UHF Electronics and Microelectronics (LETI, St. Petersburg, 2016), Vol. 2.
11.
Zurück zum Zitat A. Yu. Isaev and K. L. Besednov, “Methods for determination of the electric conductivity of polymer glues,” Vse Materialy. Entsiklopedicheskii Spravochnik, No. 12, 57–62 (2017). A. Yu. Isaev and K. L. Besednov, “Methods for determination of the electric conductivity of polymer glues,” Vse Materialy. Entsiklopedicheskii Spravochnik, No. 12, 57–62 (2017).
12.
Zurück zum Zitat I. Mir and D. Kumar, “Recent advances in isotropic conductive adhesives for electronics packaging applications,” International Journal of Adhesion and Adhesives 28, 362–371 (2008).CrossRef I. Mir and D. Kumar, “Recent advances in isotropic conductive adhesives for electronics packaging applications,” International Journal of Adhesion and Adhesives 28, 362–371 (2008).CrossRef
13.
Zurück zum Zitat M. Inoue and J. Liu, “Effects of multi-modal filler size distributions on thermal conductivity of electrically conductive adhesives containing Ag micro and nanoparticles,” Trans. Japan Inst. Electronics Packaging 2, 125–133 (2009).CrossRef M. Inoue and J. Liu, “Effects of multi-modal filler size distributions on thermal conductivity of electrically conductive adhesives containing Ag micro and nanoparticles,” Trans. Japan Inst. Electronics Packaging 2, 125–133 (2009).CrossRef
14.
Zurück zum Zitat Y. Li and C. P. Wong, “Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications,” Mater. Sci. Eng. R, 51, 1–35 (2006).CrossRef Y. Li and C. P. Wong, “Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications,” Mater. Sci. Eng. R, 51, 1–35 (2006).CrossRef
15.
Zurück zum Zitat M. Moskovits and J. S. Suh, “Conformation of mono-and dicarboxylic acids adsorbed on silver surfaces,” J. Am. Chem. Soc. 107, 6826–6829 (1985).CrossRef M. Moskovits and J. S. Suh, “Conformation of mono-and dicarboxylic acids adsorbed on silver surfaces,” J. Am. Chem. Soc. 107, 6826–6829 (1985).CrossRef
16.
Zurück zum Zitat S. Kohinata, Y. Shiraki, M. Inoue, and K. Uenishi, “Investigation of the influence of the cure shrinkage in electrically conductive adhesive, and the mechanism for conductivity,” J. Smart Processing 3, 246–253 (2014).CrossRef S. Kohinata, Y. Shiraki, M. Inoue, and K. Uenishi, “Investigation of the influence of the cure shrinkage in electrically conductive adhesive, and the mechanism for conductivity,” J. Smart Processing 3, 246–253 (2014).CrossRef
17.
Zurück zum Zitat S. N. Gladkikh, A. S. Shestakov, T. N. Dreval’, D. V. Patin, and A. A. Savkin, “Conducting glues for assembly of electronics for use in space,” Pechatnyi Montazh, No. 3, 156–160 (2016). S. N. Gladkikh, A. S. Shestakov, T. N. Dreval’, D. V. Patin, and A. A. Savkin, “Conducting glues for assembly of electronics for use in space,” Pechatnyi Montazh, No. 3, 156–160 (2016).
18.
Zurück zum Zitat S. N. Gladkikh, A. S. Shestakov, and E. V. Kolesnikova, “Conducting glues for electronic and radio devices,” Klei. Germetiki. Tekhnologii, No. 5, 2–4 (2014). S. N. Gladkikh, A. S. Shestakov, and E. V. Kolesnikova, “Conducting glues for electronic and radio devices,” Klei. Germetiki. Tekhnologii, No. 5, 2–4 (2014).
19.
Zurück zum Zitat N. V. Antyufeeva, V. M. Aleksashin, and Yu. V. Stolyan-kov, “Modern methodological support for thermal analytic studies of polymer composites and prepregs,” Kompozity i Nanostruktury 6, 176–184 (2014). N. V. Antyufeeva, V. M. Aleksashin, and Yu. V. Stolyan-kov, “Modern methodological support for thermal analytic studies of polymer composites and prepregs,” Kompozity i Nanostruktury 6, 176–184 (2014).
20.
Zurück zum Zitat N. V. Antyufeeva, A. V. Slavin, and V. A. Bol’shakov, “Practical application pf thermal analysis in developing and studying polymer and composite materials,” Plast. Massy, No. 3, 25–27 (2019). N. V. Antyufeeva, A. V. Slavin, and V. A. Bol’shakov, “Practical application pf thermal analysis in developing and studying polymer and composite materials,” Plast. Massy, No. 3, 25–27 (2019).
21.
Zurück zum Zitat A. I. Gulyaev, A. P. Petrova, D. V. Zaitsev, and A. N. Raevskikh, “Microstructural and fractographic analysis of adhesive compound based on VK-27 epoxy resin and VK-25 phenol resin adhesives,” Polym. Sci., Ser. D 11, 401–406 (2018). A. I. Gulyaev, A. P. Petrova, D. V. Zaitsev, and A. N. Raevskikh, “Microstructural and fractographic analysis of adhesive compound based on VK-27 epoxy resin and VK-25 phenol resin adhesives,” Polym. Sci., Ser. D 11, 401–406 (2018).
22.
Zurück zum Zitat I. I. Novikov, V. S. Zolotorevskii, V. K. Portnov, et al., Science of Metals: a Textbook, Vol. 2. Thermal Processing. Alloys (Mosk. Inst. Stali i Splavov, Moscow, 2014) [in Russian]. I. I. Novikov, V. S. Zolotorevskii, V. K. Portnov, et al., Science of Metals: a Textbook, Vol. 2. Thermal Processing. Alloys (Mosk. Inst. Stali i Splavov, Moscow, 2014) [in Russian].
23.
Zurück zum Zitat N. Yuantao, W. Fei, Z. Huaizhi, and D. Deguo, “Recovery of cold deformed high pure silver,” Trans. Nonferr. Metals Soc. China 6, 105–110 (1996). N. Yuantao, W. Fei, Z. Huaizhi, and D. Deguo, “Recovery of cold deformed high pure silver,” Trans. Nonferr. Metals Soc. China 6, 105–110 (1996).
24.
Zurück zum Zitat T. Falat and J. Felba, “Conductivity Improvement of Electrically Conductive Adhesives by Thermal Post-Curing Processes,” in Proceedings of 3rd International Conference of IMAPS Poland Chapter (Krakow, 2006), pp. 1–5. T. Falat and J. Felba, “Conductivity Improvement of Electrically Conductive Adhesives by Thermal Post-Curing Processes,” in Proceedings of 3rd International Conference of IMAPS Poland Chapter (Krakow, 2006), pp. 1–5.
Metadaten
Titel
The Influence of Silver Powder Filler on the Curing Process and Structure of Conducting Adhesives
verfasst von
A. I. Gulyaev
K. L. Besednov
A. P. Petrova
N. V. Antyufeeva
Publikationsdatum
01.09.2022
Verlag
Pleiades Publishing
Erschienen in
Polymer Science, Series D / Ausgabe 3/2022
Print ISSN: 1995-4212
Elektronische ISSN: 1995-4220
DOI
https://doi.org/10.1134/S1995421222030091

Weitere Artikel der Ausgabe 3/2022

Polymer Science, Series D 3/2022 Zur Ausgabe

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen.