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Polymer Science, Series D
Erschienen in: Polymer Science, Series D 3/2022

01.09.2022

The Influence of Silver Powder Filler on the Curing Process and Structure of Conducting Adhesives

verfasst von: A. I. Gulyaev, K. L. Besednov, A. P. Petrova, N. V. Antyufeeva

Erschienen in: Polymer Science, Series D | Ausgabe 3/2022

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Abstract

The influence of silver powder filler on the process of curing of an adhesive composition was researched. The formation of the microstructure of epoxy adhesive compositions filled with silver cured at temperatures of 175 and 200°C was studied. When increasing the curing temperature to 200°C indicators of recrystallization of silver filler were revealed, as well as an increase in electric conductivity of the adhesive layer; at the same time, the shear strength of the adhesive bond did not change.
Vorheriger Artikel Deformation Properties of Elastic Adhesive in Adhesive Joints under Quasi-Static Low-Cycle Mechanical Loads
Nächster Artikel Optimizing an EDI Epoxy Binder Using the Pareto Method

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Metadaten
Titel
The Influence of Silver Powder Filler on the Curing Process and Structure of Conducting Adhesives
verfasst von
A. I. Gulyaev
K. L. Besednov
A. P. Petrova
N. V. Antyufeeva
Publikationsdatum
01.09.2022
Verlag
Pleiades Publishing
Erschienen in
Polymer Science, Series D / Ausgabe 3/2022
Print ISSN: 1995-4212
Elektronische ISSN: 1995-4220
DOI
https://doi.org/10.1134/S1995421222030091

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