Skip to main content
Disciplines
Automotive Business IT + Informatics Construction + Real Estate Electrical Engineering + Electronics Energy + Sustainability Insurance + Risk Finance + Banking Management + Leadership Marketing + Sales Mechanical Engineering + Materials
Events
DE
EN
Books
Journals
Topic Page
Marketing
Start single access now
Access for companies
EXTENDED SEARCH
Log in
Top
Microsystem Technologies
Published in: Microsystem Technologies 2/2013

01-02-2013 | Technical Paper

The monolithic integration system of bulk-Si sensors and actuators based on the Au–Au bonding technology

Authors: Chunhua Cai, Ming Qin

Published in: Microsystem Technologies | Issue 2/2013

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

The monolithic integration of bulk-Si MEMS sensors and actuators using the Au–Au bonding technology is presented in this work. With this technology, the substrate isolation and electrical interconnection between the CMOS circuits and bulk-Si CMOS MEMS sensors are achieved perfectly. In order to demonstrate this technology, a pressure sensor and an electrothermal actuator have been monolithically designed and fabricated. In addition, by sputtering aluminium on the bulk silicon electrothermal actuator, the electrothermal actuator is modified and the sensitivity of the actuator is obviously improved. The measurement results show that the sensitivity of the pressure sensor is 0.29fF/hPa. And the sensitivities of the modified and non-modified electrothermal actuators are 20.23 μm/V and 3.34 μm/V, respectively. Compared with the non-modified electrothermal actuators, the sensitivity of the modified electrothermal actuators is improved by 6 times.
previous article A novel high sensitive MEMS intraocular capacitive pressure sensor
next article Silicon isotropic and anisotropic etching for MEMS applications

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

inform now
Literature
DeHennis AD, Wise KD (2005) A wireless microsystem for the remote sensing of pressure, temperature, and relative humidity. J Microelectromech Syst 14(1):12–22CrossRef
Erismis MA, Neves HP, Moor PD, Puers R, Hoof CV (2010) A water-tight packaging of MEMS electrostatic actuators for biomedical applications. J Microsyst Technol 16(12):2109–2113CrossRef
Graf M, Jurischka R, Barrettino D, Hierlemann A (2005) 3D nonlinear modeling of microhotplates in CMOS technology for use as metal-oxide-based gas sensors. J Micromech Microeng 15(1):190–200CrossRef
Jing E, Xiong B, Wang Y (2010) Low-temperature Au–Si wafer bonding. J Micromech Microeng 20(9):095014 (6 pp)CrossRef
Judy MW (2004) Evolution of integrated inertial MEMS technology. In: Proceedings of solid-state sensor, actuator and microsystem workshop, Hilton Head Island, pp 27–32
Karbasi SM, Shamshirsaz M, Naraghi M, Maroufi M (2010) Optimal design analysis of electrothermally driven microactuators. J. Microsyst Technol 16(7):1065–1071CrossRef
Kühne S, Hierold C (2011) Wafer-level bonding and direct electrical interconnection of stacked 3D MEMS by a hybrid low temperature process. Sens Actuators A 172(1):341–346CrossRef
Liu JW, Shang JT, Tang JY, Huang QA (2011) Micromachining of Pyrex 7740 glass by silicon molding and vacuum anodic bonding. J Microelectromech Syst 20(4):909–915CrossRef
Luo H, Zhang G, Fedder GK, Carley LR (2002) A post-CMOS micromachined lateral accelerometer. J Microelectromech Syst 11(3):188–195CrossRef
Neumann JJ, Gabriel KJ (2002) CMOS-MEMS membrane for audio-frequency acoustic actuation. Sens Actuators A 95(2–3):175–182
Park WT, Jang JW, Clare T, Liu L (2011) Microstructure and mechanical properties of aluminum–germanium eutectic bonding with polysilicon metallization for microelectromechanical systems (MEMS) packaging. Scr Mater 64(8):733–736CrossRef
Paul O, Baltes H (1995) Novel fully CMOS compatible vacuum sensor. Sens Actuators A 46(1–3):428–431
Que L, Park JS, and Gianchandani YB (1999) Bent-beam electro-thermal actuators for high force applications. In: Proceedings of 12th IEEE international conferences on micro electro mechanical systems, pp 31–36
Que L, Park JS, Gianchandani YB (2001) Bent-beam electrothermal actuators—Part I: single beam and cascaded devices. J Microelectromech Syst 10(2):247–254CrossRef
Reinke J, Fedder GK, Mukherjee T (2010) CMOS-MEMS variable capacitors using electrothermal actuation. J Microelectromech Syst 19(5):1105–1115CrossRef
Sun CM, Wang C, Tsai MH, Hsie HS, and Fang W (2008) A novel double-side CMOS-MEMS post processing for monolithic sensor integration. In: Proceedings of 21st IEEE international conferences on micro electro mechanical systems, pp 90–93
Tiensuu A-L, Bexell M, Schweitz J-Å, Smith L, Johnsson S (1994) Assembling three-dimensional microstructures using gold-silicon eutectic bonding. Sens Actuators A 45(3):227–236CrossRef
Tsai JC, Lai RJ, Yin CY, Chen DS, Shen CK, Chang YT (2009) Vertical electrothermal actuator with separated metal and nitride structural layers. J Micro/Nanolith MEMS MOEMS 8(2):021114 (8 pp)
Wolffenbuttel RF, Wise KD (1994) Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature. Sens Actuators A 43(1–3):223–229
Zhang Y, Huang QA, Li RG, Li W (2006) Macro-modeling for polysiliconcascadedbent beam electrothermal microactuators. Sens Actuators A 128(1):165–175CrossRef
Metadata
Title
The monolithic integration system of bulk-Si sensors and actuators based on the Au–Au bonding technology
Authors
Chunhua Cai
Ming Qin
Publication date
01-02-2013
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 2/2013
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-012-1583-0

Other articles of this Issue 2/2013

Microsystem Technologies 2/2013 Go to the issue

Technical Paper

Light-actuated water droplet motions on ZnO nanorods

Technical Paper

Fabrication of cantilever with self-sharpening nano-silicon-tip for AFM applications

Technical Paper

A novel high sensitive MEMS intraocular capacitive pressure sensor

Technical Paper

Electromagnetically force balanced polymer accelerometer

Technical Paper

Silver (Ag) as a novel masking material in glass etching for microfluidics applications

Technical Paper

Micromachined ultrasonic transducers based on lead zirconate titanate (PZT) films