Advertisement
Published in:
06-06-2019
Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder
Published in: Journal of Materials Science: Materials in Electronics | Issue 14/2019
Log inActivate our intelligent search to find suitable subject content or patents.
Select sections of text to find matching patents with Artificial Intelligence. powered by
Select sections of text to find additional relevant content using AI-assisted search. powered by
Abstract
Flip-chip light-emitting diode (FCLED) packages were interconnected with various contents of Sn-decorated multi-walled carbon nanotube (Sn–MWCNT) composite solder. The Sn–MWCNT was synthesized with a Sn solution using polyol to decorate Sn nanoparticle on the surface of MWCNTs. The Sn-58Bi solder pastes containing Sn–MWCNTs were printed on the metal-printed circuit boards, and then bonded with a flip-chip bonder. The mechanical property of FCLED packages with various contents of Sn–MWCNTs were evaluated with a bond tester. Thermal property was measured with IR Camera and laser flash analysis. The shear strength of an LED chip with 0.1 wt% Sn–MWCNT solder increased about 25% over that without Sn–MWCNT. The LED chip temperature with 0.1 wt% Sn–MWCNT nanocomposite solder decreased about 7% compared to that of the Sn-58Bi solder.