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Microsystem Technologies

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01-04-2012 | Technical Paper

Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy

Authors: Hugo Durou, David Pech, David Colin, Patrice Simon, Pierre-Louis Taberna, Magali Brunet

Published in: Microsystem Technologies | Issue 4/2012

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Abstract

In this paper a wafer-level process is proposed to fully integrate carbon-based micro-supercapacitor onto silicon substrate. This process relies on the deposition of a paste containing carbon, PVDF and acetone into cavities etched in silicon. After electrolyte deposition in a controlled atmosphere, a wafer-level encapsulation is realized. Cyclic voltammetry performed on non-encapsulated micro-components showed specific energy of 257 mJ cm⁻² for 336 μm deep cavities. The specific encapsulation process developed was tested separately and proved to be efficient in terms of resistance to organic electrolytes and mechanical strength.

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Title: Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy
Authors: Hugo Durou
David Pech
David Colin
Patrice Simon
Pierre-Louis Taberna
Magali Brunet
Publication date: 01-04-2012
Publisher: Springer-Verlag
Published in: Microsystem Technologies / Issue 4/2012
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI: https://doi.org/10.1007/s00542-011-1415-7

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