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23-10-2017 | Technical Paper

Wafer-level micropackaging in thin film technology for RF MEMS applications

Authors: A. Persano, P. Siciliano, F. Quaranta, A. Taurino, A. Lucibello, Romolo Marcelli, G. Capoccia, E. Proietti, A. Bagolini, J. Iannacci

Published in: Microsystem Technologies | Issue 1/2018

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Abstract

In this work, a thin-film packaging was developed to be used for radio-frequency microelectromechanical system configurations. The fabricated packages are suspended membranes in the multilayer Si_xN_y/aSi/Si_xN_y on conductive coplanar waveguides (CPWs) of different length. Several geometric parameters of the membranes, which are the length, the curvature radius at the vertices of the rectangular base, the density and the diameter of holes on the capping surface, were also varied. The mechanical properties of the suspended membranes were investigated by mechanical simulations and surface profilometry measurements as a function of the geometric parameters. RF characterization was performed to evaluate the impact of the package on the CPW performance. Finally, network analysis was carried out, allowing to clarify the origin of the RF losses measured for the fabricated microdevices.

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Title: Wafer-level micropackaging in thin film technology for RF MEMS applications
Authors: A. Persano
P. Siciliano
F. Quaranta
A. Taurino
A. Lucibello
Romolo Marcelli
G. Capoccia
E. Proietti
A. Bagolini
J. Iannacci
Publication date: 23-10-2017
Publisher: Springer Berlin Heidelberg
Published in: Microsystem Technologies / Issue 1/2018
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI: https://doi.org/10.1007/s00542-017-3583-6

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