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18-09-2015

Aging resistance and mechanical properties of Sn3.0Ag0.5Cu solder bump joints with different bump shapes

Authors: Ping Chen, Xiu-Chen Zhao, Ying Liu, Hong Li, Yong Wang

Published in: Rare Metals | Issue 1/2021

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Abstract

The effects of bump shape on the aging resistance and mechanical properties of Sn3.0Ag0.5Cu (SAC) solder bump joints were investigated by high-temperature aging test and shear test. Three different SAC solder bump joints with barrel type, cylinder type, and hourglass type, respectively, were provided by controlling solder process. The results indicate that as the bump volume decreases from barrel bump to hourglass bump in the reflow, the thickness growth rate of intermetallic compounds (IMCs) between different solder joints and Cu substrates in the isothermal aging of 150 °C decreases. And the change of shear strength of hourglass interconnection solder joint with the increase in temperature is the minimum in the three interconnection solder joints. Thus, as the solder dosage decreases properly, hourglass interconnection solder joint is obtained, which is avail to enhance the solder joint reliability at the high-temperature aging and the ability to adapt to the change of environment temperature suddenly.

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Title: Aging resistance and mechanical properties of Sn3.0Ag0.5Cu solder bump joints with different bump shapes
Authors: Ping Chen
Xiu-Chen Zhao
Ying Liu
Hong Li
Yong Wang
Publication date: 18-09-2015
Publisher: Nonferrous Metals Society of China
Published in: Rare Metals / Issue 1/2021
Print ISSN: 1001-0521
Electronic ISSN: 1867-7185
DOI: https://doi.org/10.1007/s12598-015-0612-4

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