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Published in: Journal of Materials Science: Materials in Electronics 5/2013

01-05-2013

Bi1.5Zn1.0Nb1.5O7 thin films deposited at low temperature and post-annealed for crystallization

Authors: Xiaohua Zhang, Wei Ren, Peng Shi

Published in: Journal of Materials Science: Materials in Electronics | Issue 5/2013

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Abstract

Near-stoichiometric Bi1.5Zn1.0Nb1.5O7 (BZN) thin films were prepared on Pt/TiO2/SiO2/Si (100) substrates at 400 °C under an oxygen pressure of 10 Pa by using pulsed laser deposition process. The as-deposited BZN thin films were post-annealed at 700 °C for 30 min in situ vacuum chamber (in situ) and in oxygen ambient oven (ex situ). The crystallinity, microstructure and electrical properties of BZN thin films were investigated. The X-ray diffractometer results indicate that BZN thin films deposited at 400 °C are amorphous in nature and the post-annealed thin films exhibit a cubic pyrochlore structure. The as-deposited BZN thin films show permittivity of 68 and loss tangent of 0.0011 at 10 kHz, respectively. After a post-annealing at 700 °C for 30 min, the dielectric properties of thin films are significantly improved. Permittivity and loss tangent of the in situ annealed films are 127 and 0.005 at 10 kHz, respectively. And the films post-annealed in O2 oven show the largest permittivity of 170 and tangent of 0.006. The improved dielectric properties can attribute to the crystallization of thin films. BZN thin films deposited at low temperature and crystallized at high temperature show the dielectric tunability without an electric breakdown to the maximum measurement bias voltage. And BZN thin films also show the excellent leakage current properties.

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Literature
1.
go back to reference J.W. Lu, Z.Q. Chen, T.R. Taylor, S. Stemmer, J. Vac. Sci. Technol. A 21, 1745 (2003)CrossRef J.W. Lu, Z.Q. Chen, T.R. Taylor, S. Stemmer, J. Vac. Sci. Technol. A 21, 1745 (2003)CrossRef
2.
go back to reference W. Ren, S. Trolier-McKinsky, C.A. Randall, T.S. Shrout, J. Appl. Phys. 89, 767 (2001)CrossRef W. Ren, S. Trolier-McKinsky, C.A. Randall, T.S. Shrout, J. Appl. Phys. 89, 767 (2001)CrossRef
3.
go back to reference X.H. Zhang, W. Ren, P. Shi, X.F. Chen, X.Q. Wu, Appl. Surf. Sci. 256, 1861 (2010)CrossRef X.H. Zhang, W. Ren, P. Shi, X.F. Chen, X.Q. Wu, Appl. Surf. Sci. 256, 1861 (2010)CrossRef
4.
go back to reference X.H. Zhang, W. Ren, P. Shi, X.F. Chen, X.Q. Wu, Appl. Surf. Sci. 256, 6607 (2010)CrossRef X.H. Zhang, W. Ren, P. Shi, X.F. Chen, X.Q. Wu, Appl. Surf. Sci. 256, 6607 (2010)CrossRef
5.
go back to reference R.L. Thayer, C.A. Randall, S. Trolier-McKinstry, J. Appl. Phys. 94, 1941 (2003)CrossRef R.L. Thayer, C.A. Randall, S. Trolier-McKinstry, J. Appl. Phys. 94, 1941 (2003)CrossRef
6.
go back to reference K. Sudheendran, M. Ghanashyam Krishna, K.C. James Raju, Appl. Phys. A 95, 485 (2009)CrossRef K. Sudheendran, M. Ghanashyam Krishna, K.C. James Raju, Appl. Phys. A 95, 485 (2009)CrossRef
7.
go back to reference X.H. Zhang, W. Ren, P. Shi, X.L. Zhan, Z. Wang, P. Shi, X.F. Chen, X.Q. Wu, X. Yao, Thin Solid Films 520, 5141 (2012)CrossRef X.H. Zhang, W. Ren, P. Shi, X.L. Zhan, Z. Wang, P. Shi, X.F. Chen, X.Q. Wu, X. Yao, Thin Solid Films 520, 5141 (2012)CrossRef
8.
go back to reference I. Levina, T.G. Amos, J.C. Nino, T.A. Vanderah, I.M. Reaney, J. Mater. Res. 17, 1406 (2002)CrossRef I. Levina, T.G. Amos, J.C. Nino, T.A. Vanderah, I.M. Reaney, J. Mater. Res. 17, 1406 (2002)CrossRef
9.
go back to reference X.H. Zhang, W. Ren, P. Shi, M. Saeed Khan, X.F. Chen, X.Q. Wu, X. Yao, J. Alloys Compd. 509, 9302 (2011)CrossRef X.H. Zhang, W. Ren, P. Shi, M. Saeed Khan, X.F. Chen, X.Q. Wu, X. Yao, J. Alloys Compd. 509, 9302 (2011)CrossRef
10.
go back to reference H. Wang, S. Kamba, M.L. Zhang, X. Yao, S. Denisov, F. Kadlec, J. Petzelt, J. Appl. Phys. 100, 034109 (2006)CrossRef H. Wang, S. Kamba, M.L. Zhang, X. Yao, S. Denisov, F. Kadlec, J. Petzelt, J. Appl. Phys. 100, 034109 (2006)CrossRef
11.
12.
go back to reference Z.Z. Tang, S.J. Liu, R.K. Singh, S. Bandyopadhyay, I. Sus, T. Kotani, M.V. Schilfgaarde, N. Newman, Acta Mater. 57, 432 (2009)CrossRef Z.Z. Tang, S.J. Liu, R.K. Singh, S. Bandyopadhyay, I. Sus, T. Kotani, M.V. Schilfgaarde, N. Newman, Acta Mater. 57, 432 (2009)CrossRef
Metadata
Title
Bi1.5Zn1.0Nb1.5O7 thin films deposited at low temperature and post-annealed for crystallization
Authors
Xiaohua Zhang
Wei Ren
Peng Shi
Publication date
01-05-2013
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 5/2013
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-012-0981-5

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