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Microsystem Technologies

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01-03-2013 | Technical Paper

BPN a new thick negative photoresist with high aspect ratio for MEMS applications

Authors: D. Bourrier, M. Dilhan, A. Ghannam, L. Ourak, H. Granier

Published in: Microsystem Technologies | Issue 3/2013

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Abstract

The BPN is a negative photoresist, sensitive in the UV at 365 nm and was previously dedicated for Wafer Level Packaging (WLP) applications. This photoresist offer the advantage of forming thick layers, however, it suffers from low aspect ratio (2:1 declared by the supplier). This work reports the optimization of BPN’s technological process enabling forming 30–160 μm thick molds for electroplating purposes. Our results revealed an aspect ratio as high as 16:1 while having vertical sidewalls using conventional photolithography.

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Title: BPN a new thick negative photoresist with high aspect ratio for MEMS applications
Authors: D. Bourrier
M. Dilhan
A. Ghannam
L. Ourak
H. Granier
Publication date: 01-03-2013
Publisher: Springer-Verlag
Published in: Microsystem Technologies / Issue 3/2013
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI: https://doi.org/10.1007/s00542-012-1648-0

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