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Journal of Electronic Materials
Published in: Journal of Electronic Materials 3/2011

01-03-2011

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

Authors: F. X. Che, W. H. Zhu, Edith S. W. Poh, X. R. Zhang, Xiaowu Zhang, T. C. Chai, S. Gao

Published in: Journal of Electronic Materials | Issue 3/2011

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previous article Preparation of Bi0.85Nd0.15FeO3 Nanotube Arrays by a Sol–Gel Template Method
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Metadata
Title
Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition
Authors
F. X. Che
W. H. Zhu
Edith S. W. Poh
X. R. Zhang
Xiaowu Zhang
T. C. Chai
S. Gao
Publication date
01-03-2011
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 3/2011
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-011-1510-7

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Effects of Bonding Temperature and Pressure on the Electrical Resistance of Cu/Sn/Cu Joints for 3D Integration Applications

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