Issue 3/2011
Content (16 Articles)
Fabrication of Metal–Oxide–Diamond Field-Effect Transistors with Submicron-Sized Gate Length on Boron-Doped (111) H-Terminated Surfaces Using Electron Beam Evaporated SiO2 and Al2O3
Takeyasu Saito, Kyung-ho Park, Kazuyuki Hirama, Hitoshi Umezawa, Mitsuya Satoh, Hiroshi Kawarada, Zhi-Quan Liu, Kazutaka Mitsuishi, Kazuo Furuya, Hideyo Okushi
Tailoring the Structural and Optoelectronic Properties of Al-Doped Nanocrystalline ZnO Thin Films
C. Periasamy, P. Chakrabarti
The Influence of Film Thickness on the Transparency and Conductivity of Al-Doped ZnO Thin Films Fabricated by Ion-Beam Sputtering
Guang-Xing Liang, Ping Fan, Xing-Min Cai, Dong-Ping Zhang, Zhuang-Hao Zheng
Point Defects in CdZnTe Crystals Grown by Different Techniques
R. Gul, A. Bolotnikov, H. K. Kim, R. Rodriguez, K. Keeter, Z. Li, G. Gu, R. B. James
The Distribution Tail of LWIR HgCdTe-on-Si FPAs: a Hypothetical Physical Mechanism
L. O. Bubulac, J.D. Benson, R.N. Jacobs, A.J. Stoltz, M. Jaime-Vasquez, L. A. Almeida, A. Wang, L. Wang, R. Hellmer, T. Golding, J.H. Dinan, M. Carmody, P.S. Wijewarnasuriya, M.F. Lee, M.F. Vilela, J. Peterson, S.M. Johnson, D.F. Lofgreen, D. Rhiger
Study of the Formation Mechanism of Cu/Ge/Pd Ohmic Contact to n-Type InGaAs
Y. C. Lin, Sheng-Li Shie, Tin-En Shie, Yuen-Yee Wong, K. S. Chen, E. Y. Chang
Electrical Conductivity of Parylene F at High Temperature
S. Diaham, M. Bechara, M.-L. Locatelli, C. Tenailleau
Laser Direct Writing of Conductive Silver Film on Polyimide Surface from Decomposition of Organometallic Ink
Zhixiang Cai, Xiaoyan Zeng, Jianguo Liu
Interfacial Reactions of Sn-3.5Ag-xZn Solders and Cu Substrate During Liquid-State Aging
Lijuan Liu, Wei Zhou, Wenkai Mu, Ping Wu
Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn-xAg/Cu Joints
M. L. Huang, Y. Z. Huang, H. T. Ma, J. Zhao
Effects of Bonding Temperature and Pressure on the Electrical Resistance of Cu/Sn/Cu Joints for 3D Integration Applications
Byunghoon Lee, Jongseo Park, Junghyun Song, Kee-won Kwon, Hoo-jeong Lee
An Investigation of Diffusion Barrier Characteristics of an Electroless Co(W,P) Layer to Lead-Free SnBi Solder
Hung-Chun Pan, Tsung-Eong Hsieh
Preparation of Bi0.85Nd0.15FeO3 Nanotube Arrays by a Sol–Gel Template Method
Dongyun Guo, Yiping Gong, Changyong Liu, Chuanbin Wang, Qiang Shen, Lianmeng Zhang
Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition
F. X. Che, W. H. Zhu, Edith S. W. Poh, X. R. Zhang, Xiaowu Zhang, T. C. Chai, S. Gao
Dielectric Properties and Microstructure of MgO-TiO2-ZnO-CaO Ceramics
Yonggang Zhang, Shunhua Wu, Jinxu Liu, Shunqi Gao