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Journal of Electronic Materials
Published in: Journal of Electronic Materials 10/2004

01-10-2004 | Special Issue Paper

Crystallization and failure behavior of Ta-Ni nanostructured/amorphous diffusion barriers for copper metallization

Authors: J. S. Fang, T. P. Hsu, G. S. Chen

Published in: Journal of Electronic Materials | Issue 10/2004

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Metadata
Title
Crystallization and failure behavior of Ta-Ni nanostructured/amorphous diffusion barriers for copper metallization
Authors
J. S. Fang
T. P. Hsu
G. S. Chen
Publication date
01-10-2004
Publisher
Springer-Verlag
Published in
Journal of Electronic Materials / Issue 10/2004
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-004-0120-z

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Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps

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Influence of Cu addition to interface microstructure between Sn-Ag solder and Au/Ni-6P plating

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