Issue 10/2004
Content (26 Articles)
Foreword
C. R. Kao, S. -W. Chen, H. M. Lee, S. E. Mohney, M. R. Notis, D. J. Swenson
Self-assembled Au nanoparticle superlattice via a displacement reaction
J. C. Hu, P. Y. Su, V. Lapeyronie, S. L. Cheng, M. Y. Lin, L. J. Chen
Interface reaction between Ni and amorphous SiC
Sungtae Kim, J. H. Perepezko, Z. Dong, A. S. Edelstein
Phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the sn-rich corner
Sinn-Wen Chen, Cheng-An Chang
Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates
G. Ghosh
Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints
Y. L. Lin, W. C. Luo, Y. H. Lin, C. E. Ho, C. R. Kao
Microstructure and thermal expansion properties of invar-type Cu-Zn-Al shape memory alloys
J. J. Wang, T. Omori, Y. Sutou, R. Kainuma, K. Ishida
The nanoindentation characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds in the solder bump
Guh-Yaw Jang, Jyh-Wei Lee, Jeng-Gong Duh
Bromine- and chlorine-induced degradation of gold-aluminum bonds
Min-Hsien Lue, Chen-Town Huang, Sheng-Tzung Huang, Ker-Chang Hsieh
Mechanism of interfacial reaction for the Sn-Pb solder bump with Ni/Cu under-bump metallization in flip-chip technology
Guh-Yaw Jang, Chien-Sheng Huang, Li-Yin Hsiao, Jenq-Gong Duh, Hideyuki Takahashi
Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps
S. J. Wang, H. J. Kao, C. Y. Liu
Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment
C. N. Liao, C. T. Wei
Under bump metallurgy study on copper/low-k dielectrics for fine pitch flip chip packaging
Seung Wook Yoon, Vaidyanathan Kripesh, Su Young Ji Jeffery, Mahadevan K. Iyer
Effect of partial la filling on high-temperature thermoelectric properties of IrSb3-based skutterudite compounds
S. W. Kim, Y. Kimura, Y. Mishima
Phase field simulations of intermetallic compound growth during soldering reactions
J. Y. Huh, K. K. Hong, Y. B. Kim, K. T. Kim
Semiconductor-to-metallic phase transition of VO2 by laser excitation
H. Liu, O. Vasquez, V. R. Santiago, L. Diaz, F. E. Fernandez
Crystallization and failure behavior of Ta-Ni nanostructured/amorphous diffusion barriers for copper metallization
J. S. Fang, T. P. Hsu, G. S. Chen
Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization
Sang-Won Kim, Jeong-Won Yoon, Seung-Boo Jung
Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder
Jeong-Won Yoon, Sang-Won Kim, Ja-Myeong Koo, Dae-Gon Kim, Seung-Boo Jung
Influence of Cu addition to interface microstructure between Sn-Ag solder and Au/Ni-6P plating
Chi-Won Hwang, Katsuaki Suganuma, Masayuki Kiso, Shigeo Hashimoto
Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability
Hyoung-Joon Kim, Jong-Soo Cho, Yong-Jin Park, Jin Lee, Kyung-Wook Paik
Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints
John H. L. Pang, Luhua Xu, X. Q. Shi, W. Zhou, S. L. Ngoh
The effect of microstructural and geometrical features on the reliability of ultrafine flip chip microsolder joints
Zhiheng Huang, Paul P. Conway, Changqing Liu, Rachel C. Thomson
Dielectric properties of low loss Ba6−3xNd8+2xTi18O54 thin films prepared by pulsed laser deposition for microwave applications
Y. D. Xia, G. H. Shi, D. Wu, Z. G. Liu
Capacitance-voltage characterization of pulsed plasma polymerized allylamine dielectrics for flexible polymeric field effect transistors
Yifan Xu, Paul R. Berger, Jai Cho, Richard B. Timmons
Effects of excess Bi concentration, buffered Bi2O3 layer, and Ta doping on the orientation and ferroelectricity of chemical-solution-deposited Bi3.25La0.75Ti3O12 films
Jian-Long Lin, Tian-Lin Chang, Wen-Tai Lin