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Journal of Electronic Materials
Published in: Journal of Electronic Materials 10/2004

01-10-2004 | Special Issue Paper

Phase field simulations of intermetallic compound growth during soldering reactions

Authors: J. Y. Huh, K. K. Hong, Y. B. Kim, K. T. Kim

Published in: Journal of Electronic Materials | Issue 10/2004

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Metadata
Title
Phase field simulations of intermetallic compound growth during soldering reactions
Authors
J. Y. Huh
K. K. Hong
Y. B. Kim
K. T. Kim
Publication date
01-10-2004
Publisher
Springer-Verlag
Published in
Journal of Electronic Materials / Issue 10/2004
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-004-0118-6

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