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Journal of Electronic Materials
Published in: Journal of Electronic Materials 10/2004

01-10-2004 | Special Issue Paper

Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints

Authors: John H. L. Pang, Luhua Xu, X. Q. Shi, W. Zhou, S. L. Ngoh

Published in: Journal of Electronic Materials | Issue 10/2004

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previous article Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability
next article The effect of microstructural and geometrical features on the reliability of ultrafine flip chip microsolder joints

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Metadata
Title
Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints
Authors
John H. L. Pang
Luhua Xu
X. Q. Shi
W. Zhou
S. L. Ngoh
Publication date
01-10-2004
Publisher
Springer-Verlag
Published in
Journal of Electronic Materials / Issue 10/2004
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-004-0125-7

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Mechanism of interfacial reaction for the Sn-Pb solder bump with Ni/Cu under-bump metallization in flip-chip technology

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Microstructure and thermal expansion properties of invar-type Cu-Zn-Al shape memory alloys