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Published in:
21-09-2016
Deposition of silver films on copper nanopowders by three-times electroless plating
Published in: Journal of Materials Science: Materials in Electronics | Issue 12/2016
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Abstract
In order to enhance the oxidation resistance of a copper substrate, silver films were deposited by electroless plating onto pure copper nanopowder. However, the efficiency of electroless plating for nanopowders is very low. Silver-coated copper nanopowders can be successfully achieved by three-times electroless silver plating on copper nanopowder. The microstructure and the chemical composition of the silver-coated copper nanopowders were systematically analyzed. The silver films have shown excellent oxidation resistance, according to the results of accelerated temperature cycling tests. The silver-coated copper nanopowders were characterized using scanning electron microscopy and X-ray diffraction. Following conclusions were obtained under the optimum condition that the reaction temperature was 50 °C, the dosage of EDTA was 4 g/L, hypophosphite (NaH2PO2) was 20.6 g/L. When the silver content reached 25 %, silver was homogeneously distributed around copper nanopowders.