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26-02-2024 | Original Research Article

Design and Performance Analysis of a High-temperature Sensor with a Low-temperature Coefficient of Frequency

Authors: Aditya Kumar Nagmani, Basudeba Behera

Published in: Journal of Electronic Materials | Issue 5/2024

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Abstract

A surface acoustic wave (SAW)-based temperature sensor has been designed and simulated using a (0°, 138.5°, 26.6°)-cut lanthanum gallium silicate (LGS; langasite; La₃Ga₅SiO₁₄) substrate with reduced temperature coefficient of frequency (TCF). At elevated temperatures, a slight temperature variation produces a major change in the resonance frequency of the SAW sensors, resulting in crucial accuracy problems and erroneous outcomes. To overcome these issues, a temperature-compensated sensor is required to be designed. Deposition of SiO₂ film onto the substrate is an effective approach for achieving temperature compensation in a sensor design. Accordingly, we designed a SAW resonator by depositing platinum electrodes on LGS substrate material along with a layer of SiO₂ film on top. The structure has been simulated using the 3-D finite element model method. The temperature-dependent characteristics of the model have been investigated for different thicknesses of the SiO₂ coating layer at elevated temperatures. It was found that the TCF is reduced to 4.3 ppm/°C at 500°C operating temperature with a 1.9-μm-thick SiO₂ film. A zero TCF was also achieved for 0.9-μm-thick SiO2 film at an operating temperature of 300°C, which signifies the effective temperature compensation of the model. The simulation results also revealed that the SAW velocity increases while the coupling factor (k²) decreases with increasing SiO₂ thickness. This sensor can be used for health monitoring in heavy industries as well as in combustion engines to enhance fuel efficiency.

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Title: Design and Performance Analysis of a High-temperature Sensor with a Low-temperature Coefficient of Frequency
Authors: Aditya Kumar Nagmani
Basudeba Behera
Publication date: 26-02-2024
Publisher: Springer US
Published in: Journal of Electronic Materials / Issue 5/2024
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI: https://doi.org/10.1007/s11664-024-10969-2

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