Skip to main content
Top
Published in: Journal of Materials Science: Materials in Electronics 23/2017

22-08-2017

Dielectric and thermal properties of epoxy resins with TiO2 nanowires

Authors: Qian Xie, Yonghong Cheng, Siyu Chen, Guanglei Wu, Zhengdong Wang, Zirui Jia

Published in: Journal of Materials Science: Materials in Electronics | Issue 23/2017

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

Epoxy based composites with reinforced dielectric properties were successfully synthesized by using TiO2 nanowires as inorganic filler. TiO2 nanoparticle/epoxy composites were also prepared as a contrast. TiO2 nanowires were synthesized by a hydrothermal method, with an average diameter of 50 nm and a length of 5 µm. TiO2 nanoparticles were purchased with average diameter of ~60 nm. Scanning electron microscopy images show that two types of fillers are both homogeneously dispersed in the matrix. Although the specific surface area of TiO2 nanoparticles is about twice of that of TiO2 nanowires, remarkable improved dielectric constant, enhanced electrical and thermal conductivity, higher space charge accumulation and stronger charge carrier mobility were observed in nanowire filled epoxy resin at the same filler content. Meanwhile, nanowires composites exhibit excellent glass transition temperature and thermal stability. These results indicated that the geometry of filler had a profound impact on the performance of epoxy composites, and nanowire filling is more effective than nanoparticle filling to enhance the properties of epoxy resin.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Literature
1.
go back to reference P. Barber, S. Balasubramanian, Y. Anguchamy, S. Gong, A. Wibowo, H. Gao, H.J. Ploehn, H. Zur Loye, Materials 2, 1697 (2009)CrossRef P. Barber, S. Balasubramanian, Y. Anguchamy, S. Gong, A. Wibowo, H. Gao, H.J. Ploehn, H. Zur Loye, Materials 2, 1697 (2009)CrossRef
2.
go back to reference H. Lv, Z. Yang, Y. Cheng, L. Wang, B. Zhang, Y. Zhao, Z. Xu, G. Ji, J. Mater. Chem. C 5, 491 (2017)CrossRef H. Lv, Z. Yang, Y. Cheng, L. Wang, B. Zhang, Y. Zhao, Z. Xu, G. Ji, J. Mater. Chem. C 5, 491 (2017)CrossRef
3.
go back to reference J. Gu, Y. Guo, X. Yang, C. Liang, W. Geng, L. Tang, N. Li, Q. Zhang, Compos. Part A 95, 267 (2017)CrossRef J. Gu, Y. Guo, X. Yang, C. Liang, W. Geng, L. Tang, N. Li, Q. Zhang, Compos. Part A 95, 267 (2017)CrossRef
6.
8.
go back to reference H. Lv, Y. Guo, G. Wu, G. Ji, Y. Zhao, Z. Xu, ACS Appl. Mater. Interfaces 9, 5660 (2017)CrossRef H. Lv, Y. Guo, G. Wu, G. Ji, Y. Zhao, Z. Xu, ACS Appl. Mater. Interfaces 9, 5660 (2017)CrossRef
9.
go back to reference J. Gu, W. Dong, Y. Tang, Y. Guo, L. Tang, J. Kong, J. Mater. Chem. C 5, 6929 (2017)CrossRef J. Gu, W. Dong, Y. Tang, Y. Guo, L. Tang, J. Kong, J. Mater. Chem. C 5, 6929 (2017)CrossRef
10.
11.
12.
13.
go back to reference G. Wu, Y. Cheng, Q. Xie, Z. Jia, F. Xiang, H. Wu, Mater. Lett. 144, 157 (2015)CrossRef G. Wu, Y. Cheng, Q. Xie, Z. Jia, F. Xiang, H. Wu,  Mater. Lett. 144, 157 (2015)CrossRef
16.
go back to reference H.L. Xu, X.W. Yin, M. Zhu, M.K. Han, Z.X. Hou, X.L. Li, L.T. Zhang, ACS Appl. Mater. Interfaces 9, 6332 (2017)CrossRef H.L. Xu, X.W. Yin, M. Zhu, M.K. Han, Z.X. Hou, X.L. Li, L.T. Zhang, ACS Appl. Mater. Interfaces 9, 6332 (2017)CrossRef
20.
21.
go back to reference Y. Feng, W.L. Li, Y.F. Hou, Y. Yu, W.P. Cao, T.D. Zhang, W.D. Fei, J. Mater. Chem. C 3, 1250 (2015)CrossRef Y. Feng, W.L. Li, Y.F. Hou, Y. Yu, W.P. Cao, T.D. Zhang, W.D. Fei, J. Mater. Chem. C 3, 1250 (2015)CrossRef
22.
go back to reference H. Wu, Y. Wang, C. Zheng, J. Zhu, G. Wu, X. Li, J. Alloys Compd. 685, 8 (2016)CrossRef H. Wu, Y. Wang, C. Zheng, J. Zhu, G. Wu, X. Li, J. Alloys Compd. 685, 8 (2016)CrossRef
23.
go back to reference Y. Yu, C.M. Ma, C. Teng, Y. Huang, H. Tien, S. Lee, I. Wang, J. Taiwan Inst. Chem. E 44, 654 (2013)CrossRef Y. Yu, C.M. Ma, C. Teng, Y. Huang, H. Tien, S. Lee, I. Wang, J. Taiwan Inst. Chem. E 44, 654 (2013)CrossRef
24.
go back to reference C. Grimaldi, M. Mionic, R. Gaal, L. Forro, A. Magrez, Appl. Phys. Lett. 102 (2013) C. Grimaldi, M. Mionic, R. Gaal, L. Forro, A. Magrez, Appl. Phys. Lett. 102 (2013)
25.
go back to reference K. Rasool, M.A. Rafiq, C.B. Li, E. Krali, Z. Durrani, M.M. Hasan, Appl. Phys. Lett. 101, 23114 (2012)CrossRef K. Rasool, M.A. Rafiq, C.B. Li, E. Krali, Z. Durrani, M.M. Hasan, Appl. Phys. Lett. 101, 23114 (2012)CrossRef
27.
go back to reference C. Pan, K. Kou, Q. Jia, Y. Zhang, G. Wu, T. Ji, Compos. Part B 111, 83 (2017)CrossRef C. Pan, K. Kou, Q. Jia, Y. Zhang, G. Wu, T. Ji, Compos. Part B 111, 83 (2017)CrossRef
29.
31.
32.
go back to reference J. Gu, W. Dong, S. Xu, Y. Tang, L. Ye, J. Kong, Compos. Sci. Technol. 144, 185 (2017)CrossRef J. Gu, W. Dong, S. Xu, Y. Tang, L. Ye, J. Kong, Compos. Sci. Technol. 144, 185 (2017)CrossRef
33.
go back to reference Y. Wang, W. Zhang, X. Wu, C. Luo, Q. Wang, J. Li, L. Hu, Synthetic Met. 228, 18 (2017)CrossRef Y. Wang, W. Zhang, X. Wu, C. Luo, Q. Wang, J. Li, L. Hu, Synthetic Met. 228, 18 (2017)CrossRef
34.
35.
36.
37.
go back to reference J. Katayama, Y. Ohki, N. Fuse, M. Kozako, T. Tanaka, IEEE Trans. Dielect. Electr. Insul. 20, 157 (2013)CrossRef J. Katayama, Y. Ohki, N. Fuse, M. Kozako, T. Tanaka, IEEE Trans. Dielect. Electr. Insul. 20, 157 (2013)CrossRef
38.
go back to reference G. Wu, J. Li, K. Wang, A. Feng, J. Mater. Sci. Mater. El. 28(9), 6544 (2017)CrossRef G. Wu, J. Li, K. Wang, A. Feng, J. Mater. Sci. Mater. El. 28(9), 6544 (2017)CrossRef
39.
40.
41.
go back to reference N. Guo, S.A. DiBenedetto, P. Tewari, M.T. Lanagan, M.A. Ratner, T.J. Marks, Chem. Mater. 22, 1567 (2010)CrossRef N. Guo, S.A. DiBenedetto, P. Tewari, M.T. Lanagan, M.A. Ratner, T.J. Marks, Chem. Mater. 22, 1567 (2010)CrossRef
42.
43.
go back to reference Z. Miao, D. Xu, J. Ouyang, G. Guo, X. Zhao, Y. Tang, Nano Lett. 2, 717 (2002)CrossRef Z. Miao, D. Xu, J. Ouyang, G. Guo, X. Zhao, Y. Tang, Nano Lett. 2, 717 (2002)CrossRef
46.
go back to reference V. Gun’Ko, V. Zarko, E. Goncharuk, L. riyko, V. Turov, Y. Nychiporuk, R. Leboda, A. Gabchak, V.D. Osovskii, et al Adv. Colloid Interface 131, 1 (2007)CrossRef V. Gun’Ko, V. Zarko, E. Goncharuk, L. riyko, V. Turov, Y. Nychiporuk, R. Leboda, A. Gabchak, V.D. Osovskii, et al Adv. Colloid Interface 131, 1 (2007)CrossRef
47.
Metadata
Title
Dielectric and thermal properties of epoxy resins with TiO2 nanowires
Authors
Qian Xie
Yonghong Cheng
Siyu Chen
Guanglei Wu
Zhengdong Wang
Zirui Jia
Publication date
22-08-2017
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 23/2017
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-017-7728-2

Other articles of this Issue 23/2017

Journal of Materials Science: Materials in Electronics 23/2017 Go to the issue