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Journal of Materials Engineering and Performance

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08-03-2016

Dissolution at Interfaces in Layered Solid-Liquid Thin Films: A Key Step in Joining Process

Authors: F. Baras, V. Turlo, O. Politano

Published in: Journal of Materials Engineering and Performance | Issue 8/2016

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Abstract

We have studied the dissolution process of Ni into liquid Al in Ni-Al multilayer nanofilms by means of molecular dynamics simulations. The elemental mechanisms underlying the dissolution process were described and found to be diffusion-limited. The subsequent evolution leading to intermetallic compound formation was analyzed and interpreted on the basis of classical nucleation theory. A better understanding of the microscopic behavior of Ni-Al reactive multilayer foils, which was essential for their use in joining applications, was obtained.

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Title: Dissolution at Interfaces in Layered Solid-Liquid Thin Films: A Key Step in Joining Process
Authors: F. Baras
V. Turlo
O. Politano
Publication date: 08-03-2016
Publisher: Springer US
Published in: Journal of Materials Engineering and Performance / Issue 8/2016
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI: https://doi.org/10.1007/s11665-016-1989-4

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