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Published in: Journal of Materials Science: Materials in Electronics 8/2014

01-08-2014

Effect of loading rate on the creep behaviour of epoxy resin insulators by nanoindentation

Authors: Kunkun Fu, Yuan Chang, Youhong Tang, Bailin Zheng

Published in: Journal of Materials Science: Materials in Electronics | Issue 8/2014

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Abstract

In the present work, the effect of loading rate on indentation creep was studied. Indentation creep tests were conducted on epoxy resin to provide creep deformation under constant load, contact creep compliance and cut-off time using a Berkovich indenter. Several loading rates, ranging from 0.25 to 6 mN/s, were used to perform the tests. The results showed that there is a strong loading rate dependence on creep response of the epoxy resin under indentation. Contact creep compliance and cut-off time decreased with increasing loading rate. In contrast, an increase in reduced modulus, hardness, displacement variation and contact creep compliance variation during the holding time was noticed. The loading rate sensitivity on creep response under indentation can be attributed to viscoelastic response prior to holding segment and strain rate effect on yield stress of the epoxy resin. This study provided an insight to understand the loading rate dependence on creep behaviour of epoxy resin under indentation.

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Metadata
Title
Effect of loading rate on the creep behaviour of epoxy resin insulators by nanoindentation
Authors
Kunkun Fu
Yuan Chang
Youhong Tang
Bailin Zheng
Publication date
01-08-2014
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 8/2014
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2055-3

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