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Journal of Materials Science: Materials in Electronics

Published in:

27-04-2022

Effect of Ni foam addition on the microstructure and mechanical properties of In–48Sn eutectic alloy

Authors: Kai Liu, Jiaqi Li, Jian Zhang, Yong Xiao

Published in: Journal of Materials Science: Materials in Electronics | Issue 16/2022

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Abstract

In this study, In–48Sn eutectic solder was strengthened with Ni foam (90%, 80%, 70%, and 50% porosities) to improve its mechanical properties, then the composite solders were used to join the Ag-plated 5A06–Al alloy at 150 °C. The Ni foam had a three-dimensional network structure and combined well with the In–48Sn solder matrix. The tensile strength of the composite solder increased as the volume fraction of the Ni foam reinforcement improved. The tensile strength of the 50% porosity Ni foam reinforced In–48Sn composite solder was 62.12 MPa, which was 2.69 times higher than the superimposed strength of the Ni foam and In–48Sn solder. A theoretical model was established to analyze the strengthening mechanism and fracture mechanism of composite solder. Al alloy joints bonded with Ni foam reinforced In–48Sn composite solder showed much higher shear strength than that soldered with In–48Sn eutectic solder, and the shear strength of joints increased with improving Ni foam volume fraction.

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Title: Effect of Ni foam addition on the microstructure and mechanical properties of In–48Sn eutectic alloy
Authors: Kai Liu
Jiaqi Li
Jian Zhang
Yong Xiao
Publication date: 27-04-2022
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 16/2022
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-022-08209-6

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