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Published in: Journal of Materials Science: Materials in Electronics 9/2015

01-09-2015

Effect of O2 flow rate in the annealing process on metal–insulator transition of vanadium oxide thin films

Authors: Na Li, Ming Hu, Ji-Ran Liang, Xing Liu, Mai-Jun Wu

Published in: Journal of Materials Science: Materials in Electronics | Issue 9/2015

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Abstract

Vanadium oxide (VOx) thin films were fabricated on the sapphire substrates by sputtering deposition and subsequent rapid-thermal-annealing (RTA) process. The effect of O2 flow rate on the crystal structure, surface morphology and phase transition property of thin films was studied. The results indicated that VOx thin films were polycrystalline structures and consisted of irregular blocky-shaped grains. As the O2 flow rate increased from 3 to 4.5 slpm, the oxidation was enhanced and the grain size decreased gradually. In addition, when we increased O2 flow rate, phase transition amplitude increased from 5.4 to 117 and the phase transition temperature decreased from 50.45 °C to 45.37 °C. The hysteresis width almost increased as O2 flow rate increased. More interesting, we found that the value of \(d\lg {\text{R}}_{\square } /dT\) became big at high temperature which could be attributed to the phase transition and the variation trend of difference was in line with the phase transition amplitude. So, it could be concluded that O2 flow rate in the RTA process played a significant role in the properties of VOx thin films.

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Literature
1.
go back to reference P. Limelette, A. Georges, D. Jerome, P. Wzietek, P. Metcalf, J.M. Honig, Science 302, 89–92 (2003)CrossRef P. Limelette, A. Georges, D. Jerome, P. Wzietek, P. Metcalf, J.M. Honig, Science 302, 89–92 (2003)CrossRef
2.
3.
go back to reference Y.Y. Luo, L.Q. Zhu, Y.X. Zhang, S.S. Pan, S.C. Xu, M. Liu, G.H. Li, J. Appl. Phys. 113, 183520 (2013)CrossRef Y.Y. Luo, L.Q. Zhu, Y.X. Zhang, S.S. Pan, S.C. Xu, M. Liu, G.H. Li, J. Appl. Phys. 113, 183520 (2013)CrossRef
4.
go back to reference E.M. Heckman, L.P. Gonzalez, S. Guha, J.O. Barnes, A. Carpenter, Thin Solid Films 518, 265–268 (2009)CrossRef E.M. Heckman, L.P. Gonzalez, S. Guha, J.O. Barnes, A. Carpenter, Thin Solid Films 518, 265–268 (2009)CrossRef
5.
go back to reference M.M. Rahman, J.Z. Wang, N.H. Idris, Z.X. Chen, H.K. Liu, Electrochim. Acta 56, 693–699 (2010)CrossRef M.M. Rahman, J.Z. Wang, N.H. Idris, Z.X. Chen, H.K. Liu, Electrochim. Acta 56, 693–699 (2010)CrossRef
6.
go back to reference T. Driscoll, H.T. Kim, B.G. Chae, B.J. Kim, Y.W. Lee, N.M. Jokerst, S. Palit, D.R. Smith, M.D. Ventra, D.N. Basov, Science 325, 1518–1521 (2009)CrossRef T. Driscoll, H.T. Kim, B.G. Chae, B.J. Kim, Y.W. Lee, N.M. Jokerst, S. Palit, D.R. Smith, M.D. Ventra, D.N. Basov, Science 325, 1518–1521 (2009)CrossRef
7.
go back to reference G. Seo, B.J. Kim, L.Y. Wook, H.T. Kim, Appl. Phys. Lett. 100, 011908 (2012)CrossRef G. Seo, B.J. Kim, L.Y. Wook, H.T. Kim, Appl. Phys. Lett. 100, 011908 (2012)CrossRef
8.
go back to reference M.J. Lee, Y. Park, D.S. Suh, E.H. Lee, S. Seo, D.C. Kim, R. Jung, B.S. Kang, S.E. Ahn, C.B. Lee, Adv. Mater. 19, 3919–3923 (2007)CrossRef M.J. Lee, Y. Park, D.S. Suh, E.H. Lee, S. Seo, D.C. Kim, R. Jung, B.S. Kang, S.E. Ahn, C.B. Lee, Adv. Mater. 19, 3919–3923 (2007)CrossRef
9.
go back to reference Z.L. Huang, S.H. Chen, C.H. Lv, Y. Huang, J.J. Lai, Appl. Phys. Lett. 101, 191905 (2012)CrossRef Z.L. Huang, S.H. Chen, C.H. Lv, Y. Huang, J.J. Lai, Appl. Phys. Lett. 101, 191905 (2012)CrossRef
10.
go back to reference Z.L. Huang, S.H. Chen, B.Q. Wang, Y. Huang, N.F. Liu, J. Xu, J.J. Lai, Thin Solid Films 519, 4246–4248 (2011)CrossRef Z.L. Huang, S.H. Chen, B.Q. Wang, Y. Huang, N.F. Liu, J. Xu, J.J. Lai, Thin Solid Films 519, 4246–4248 (2011)CrossRef
11.
go back to reference M. Soltani, M. Chaker, E. Haddad, R.V. Kruzelecky, J. Margot, Appl. Phys. Lett. 85, 1958–1960 (2004)CrossRef M. Soltani, M. Chaker, E. Haddad, R.V. Kruzelecky, J. Margot, Appl. Phys. Lett. 85, 1958–1960 (2004)CrossRef
12.
go back to reference M.B. Sahana, M.S. Dharmaprakash, S.A. Shivashankar, J. Mater. Chem. 12, 333–338 (2002)CrossRef M.B. Sahana, M.S. Dharmaprakash, S.A. Shivashankar, J. Mater. Chem. 12, 333–338 (2002)CrossRef
13.
go back to reference D. Vernardou, M.E. Pemble, D.W. Sheel, Chem. Vap. Depos. 12, 263–274 (2006)CrossRef D. Vernardou, M.E. Pemble, D.W. Sheel, Chem. Vap. Depos. 12, 263–274 (2006)CrossRef
14.
go back to reference D. Vernardou, D. Louloudakis, E. Spanakis, N. Katsarakis, E. Koudoumas, Sol. Energy Mater. Sol. Cells 128, 36–40 (2014)CrossRef D. Vernardou, D. Louloudakis, E. Spanakis, N. Katsarakis, E. Koudoumas, Sol. Energy Mater. Sol. Cells 128, 36–40 (2014)CrossRef
15.
go back to reference C. Ba, S.T. Bah, M. D’Auteuil, P.V. Ashrit, R. Vallee, A.C.S. Appl, Mater. Interfaces 5, 12520–12525 (2013)CrossRef C. Ba, S.T. Bah, M. D’Auteuil, P.V. Ashrit, R. Vallee, A.C.S. Appl, Mater. Interfaces 5, 12520–12525 (2013)CrossRef
16.
go back to reference J.B.K. Kana, J.M. Ndjaka, P.O. Ateba, B.D. Ngom, N. Manyala, O. Nemraoui, A.C. Beye, M. Maaza, Appl. Surf. Sci. 254, 3959–3963 (2008)CrossRef J.B.K. Kana, J.M. Ndjaka, P.O. Ateba, B.D. Ngom, N. Manyala, O. Nemraoui, A.C. Beye, M. Maaza, Appl. Surf. Sci. 254, 3959–3963 (2008)CrossRef
17.
go back to reference Z.F. Luo, X. Zhou, D.W. Yan, D. Wang, Z.Y. Li, C.B. Yang, Y.D. Jiang, Thin Solid Films 550, 227–232 (2014)CrossRef Z.F. Luo, X. Zhou, D.W. Yan, D. Wang, Z.Y. Li, C.B. Yang, Y.D. Jiang, Thin Solid Films 550, 227–232 (2014)CrossRef
18.
go back to reference L. Mathevula, B.D. Ngom, L. Kotsedi, P. Sechogela, T.B. Doyle, M. Ghouti, M. Maaza, Appl. Surf. Sci. 314, 476–480 (2014)CrossRef L. Mathevula, B.D. Ngom, L. Kotsedi, P. Sechogela, T.B. Doyle, M. Ghouti, M. Maaza, Appl. Surf. Sci. 314, 476–480 (2014)CrossRef
19.
go back to reference J. Sakai, M. Zaghrioui, V.T. Phuoc, S. Roger, C. Autret-Lambert, K. Okimura, J. Appl. Phys. 113, 123503 (2013)CrossRef J. Sakai, M. Zaghrioui, V.T. Phuoc, S. Roger, C. Autret-Lambert, K. Okimura, J. Appl. Phys. 113, 123503 (2013)CrossRef
20.
go back to reference Y.X. Guo, Y.F. Liu, C.W. Zou, Z.W. Qi, Y.Y. Wang, Y.Q. Xu, X.L. Wang, F. Zhang, R. Zhou, Appl. Phys. A 115, 1245–1250 (2013)CrossRef Y.X. Guo, Y.F. Liu, C.W. Zou, Z.W. Qi, Y.Y. Wang, Y.Q. Xu, X.L. Wang, F. Zhang, R. Zhou, Appl. Phys. A 115, 1245–1250 (2013)CrossRef
21.
go back to reference J. Leroy, A. Bessaudou, F. Cosset, A. Crunteanu, Structural. Thin Solid Films 520, 4823–4825 (2012)CrossRef J. Leroy, A. Bessaudou, F. Cosset, A. Crunteanu, Structural. Thin Solid Films 520, 4823–4825 (2012)CrossRef
22.
go back to reference R.E. Marvel, K. Appavoo, B.K. Choi, J. Nag, R.F. Haglund, Appl. Phys. A 111, 975–981 (2013)CrossRef R.E. Marvel, K. Appavoo, B.K. Choi, J. Nag, R.F. Haglund, Appl. Phys. A 111, 975–981 (2013)CrossRef
23.
go back to reference C. Zhang, W. Cao, A.V. Adedeji, H.E. Elsayed-Ali, J. Sol–gel Sci. Technol. 69, 320–324 (2013)CrossRef C. Zhang, W. Cao, A.V. Adedeji, H.E. Elsayed-Ali, J. Sol–gel Sci. Technol. 69, 320–324 (2013)CrossRef
24.
go back to reference J. Wu, W.X. Huang, Q.W. Shi, J.H. Cai, D. Zhao, Y.B. Zhang, J.Z. Yan, Appl. Surf. Sci. 268, 556–560 (2013)CrossRef J. Wu, W.X. Huang, Q.W. Shi, J.H. Cai, D. Zhao, Y.B. Zhang, J.Z. Yan, Appl. Surf. Sci. 268, 556–560 (2013)CrossRef
25.
go back to reference Y.J. Xu, W.X. Huang, Q.W. Shi, Y.B. Zhang, J. Wu, L.W. Song, J. Mater. Sci.: Mater. Electron. 24, 3823–3829 (2013) Y.J. Xu, W.X. Huang, Q.W. Shi, Y.B. Zhang, J. Wu, L.W. Song, J. Mater. Sci.: Mater. Electron. 24, 3823–3829 (2013)
26.
go back to reference L.L. Fan, S. Chen, Y.F. Wu, F.H. Chen, W.S. Chu, X. Chen, C.W. Zou, Z.Y. Wu, Appl. Phys. Lett. 103, 131914 (2013)CrossRef L.L. Fan, S. Chen, Y.F. Wu, F.H. Chen, W.S. Chu, X. Chen, C.W. Zou, Z.Y. Wu, Appl. Phys. Lett. 103, 131914 (2013)CrossRef
27.
go back to reference S. Kittiwatanakul, J. Laverock, D. Newby, K.E. Smith, S.A. Wolf, J.W. Lu, J. Appl. Phys. 114, 053703 (2013)CrossRef S. Kittiwatanakul, J. Laverock, D. Newby, K.E. Smith, S.A. Wolf, J.W. Lu, J. Appl. Phys. 114, 053703 (2013)CrossRef
28.
go back to reference H.F. Zhang, Z.M. Wu, Q. He, Y.D. Jiang, Appl. Surf. Sci. 277, 218–222 (2013)CrossRef H.F. Zhang, Z.M. Wu, Q. He, Y.D. Jiang, Appl. Surf. Sci. 277, 218–222 (2013)CrossRef
Metadata
Title
Effect of O2 flow rate in the annealing process on metal–insulator transition of vanadium oxide thin films
Authors
Na Li
Ming Hu
Ji-Ran Liang
Xing Liu
Mai-Jun Wu
Publication date
01-09-2015
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 9/2015
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-015-3310-y

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