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Published in: Journal of Materials Science: Materials in Electronics 23/2020

11-10-2020

Effect of ultrasonic-vibration drawing process on Bi-2212 round wires

Authors: Xueqian Liu, Shengnan Zhang, Qingbin Hao, Guoqing Liu, Gaofeng Jiao, Chengshan Li, Jianqing Feng, Pingxiang Zhang

Published in: Journal of Materials Science: Materials in Electronics | Issue 23/2020

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Abstract

Bi2Sr2CaCu2O8+δ (Bi-2212)/Ag round wires were fabricated by imposing ultrasonic-vibration drawing (UVD) technique during both the single-filament and multi-filament cold-drawing processes. The frequency of ultrasonic-vibration was set fixed at 20 kHz and different output power density levels had been altered by varied amplitudes. The influence of ultrasonic-vibration on the deformation process of Ag metal sheath, filament density, Ag/superconductor ratio, wire dimension, drawing force reduction, and the superconducting properties of final wires has been systematically studied. Softening effect of ultrasonic-vibration on the Ag metal can be deduced with the decreasing drawing flow stress and drawing force under certain amplitude. It was found that powder densification could be promoted and higher filament volume fraction as well as high wire diameter uniformity had been reached with the introduction of UVD process, leading to the enhancement of Jc and JE after proper heat treatment. Such technique could be considered in fabrication of Bi-2212 long wires as well as other superconducting materials.

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Metadata
Title
Effect of ultrasonic-vibration drawing process on Bi-2212 round wires
Authors
Xueqian Liu
Shengnan Zhang
Qingbin Hao
Guoqing Liu
Gaofeng Jiao
Chengshan Li
Jianqing Feng
Pingxiang Zhang
Publication date
11-10-2020
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 23/2020
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-020-04587-x

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