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Microsystem Technologies

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01-08-2013 | Technical Paper

Effects of package on the performance of MEMS piezoresistive accelerometers

Authors: Ping Li, Shiqiao Gao, Haipeng Liu, Jun Liu, Yunbo Shi

Published in: Microsystem Technologies | Issue 8/2013

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Abstract

Package is one of the key technologies for MEMS accelerometers. This paper investigated the influence of package on performances of custom-designed MEMS piezoresistive accelerometer. Based on the designed package process, the effect of die adhesive and potting materials on the sensor sensitivity and residual stress were studied by theory analysis and experimental test. The results showed that: with more quantity of die adhesive when the thickness was fixed, the sensitivity of MEMS piezoresistive accelerometer was much smaller; in addition, with thicker die adhesive, the accelerometer had much bigger sensitivity and much smaller residual stress increment after the die attach process. Meanwhile, the sensitivity was proportional to the density of potting material, and it varied with the elastic modulus.

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Title: Effects of package on the performance of MEMS piezoresistive accelerometers
Authors: Ping Li
Shiqiao Gao
Haipeng Liu
Jun Liu
Yunbo Shi
Publication date: 01-08-2013
Publisher: Springer Berlin Heidelberg
Published in: Microsystem Technologies / Issue 8/2013
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI: https://doi.org/10.1007/s00542-012-1711-x

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