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Published in: Journal of Materials Science: Materials in Electronics 10/2013

01-10-2013

Effects of post-rapid thermal annealing on structural, electrical and optical properties of hydrogenated aluminum doped zinc oxide thin films

Authors: Ke Zhu, Ye Yang, Tiefeng Wei, Ruiqin Tan, Ping Cui, Weijie Song, Kwang-Leong Choy

Published in: Journal of Materials Science: Materials in Electronics | Issue 10/2013

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Abstract

In this study, hydrogenated aluminum doped zinc oxide (HAZO) thin films were prepared by DC magnetron sputtering in different H2/(Ar+H2) volume ratio atmosphere. The effects of post-rapid thermal annealing (RTA) in Ar+8 % H2 atmosphere on the structural, optical, and electrical properties of the thin films were investigated systematically. Results showed that the RTA treatment effectively improved the electrical conductivity of the HAZO thin films with small hydrogen content, due to the increase of the Hall mobility and the carrier concentration. The lowest resistivity of the HAZO thin film deposited in 8 % H2 ratio atmosphere reached 6.3 × 10−4 Ω cm after RTA. The improved electrical properties of the RTA-treated HAZO films were ascribed to the activation of Al dopants, the increase of oxygen vacancies and the desorption of negative charged oxygen species at the grain. These results implied that RTA process might be useful to fabricate high quality HAZO films with a low thermal budget.

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Literature
1.
go back to reference C. Agashe, O. Kluth, J. Hüpkes, U. Zastrow, B. Rech, M. Wuttig, J. Appl. Phys. 95, 1911 (2004)CrossRef C. Agashe, O. Kluth, J. Hüpkes, U. Zastrow, B. Rech, M. Wuttig, J. Appl. Phys. 95, 1911 (2004)CrossRef
2.
go back to reference M.L. Addonizio, A. Aantonaia, G. Cantele, C. Privato, Thin Solid Films 349, 93 (1999)CrossRef M.L. Addonizio, A. Aantonaia, G. Cantele, C. Privato, Thin Solid Films 349, 93 (1999)CrossRef
4.
go back to reference F. Ruske, V. Sittinger, W. Werner, B. Szyszka, K.-U. van Osten, K. Dietrich, R. Rix, Surf. Coat. Technol. 200, 236 (2005)CrossRef F. Ruske, V. Sittinger, W. Werner, B. Szyszka, K.-U. van Osten, K. Dietrich, R. Rix, Surf. Coat. Technol. 200, 236 (2005)CrossRef
5.
go back to reference Y.M. Chung, C.S. Moon, W.S. Jung, J.G. Han, Thin Solid Films 515, 567 (2006)CrossRef Y.M. Chung, C.S. Moon, W.S. Jung, J.G. Han, Thin Solid Films 515, 567 (2006)CrossRef
6.
go back to reference J.N. Duenow, T.A. Gessert, D.M. Wood, A.C. Dillon, T.J. Coutts, J. Vac. Sci. Technol. A 25, 955 (2007)CrossRef J.N. Duenow, T.A. Gessert, D.M. Wood, A.C. Dillon, T.J. Coutts, J. Vac. Sci. Technol. A 25, 955 (2007)CrossRef
7.
go back to reference S.H. Lee, T.S. Lee, K.S. Lee, B. Cheong, Y.D. Kim, W.M. Kim, J. Phys. D Appl. Phys. 41, 095303 (2008)CrossRef S.H. Lee, T.S. Lee, K.S. Lee, B. Cheong, Y.D. Kim, W.M. Kim, J. Phys. D Appl. Phys. 41, 095303 (2008)CrossRef
8.
go back to reference M.-C. Li, C.-C. Kuo, S.-H. Peng, S.-H. Chen, C.-C. Lee, Appl. Opt. 50, C197 (2011)CrossRef M.-C. Li, C.-C. Kuo, S.-H. Peng, S.-H. Chen, C.-C. Lee, Appl. Opt. 50, C197 (2011)CrossRef
9.
go back to reference B.L. Zhu, J. Wang, S.J. Zhu, J. Wu, D.W. Zeng, C.S. Xie, J. Electrochem. Soc. 159, H536 (2012)CrossRef B.L. Zhu, J. Wang, S.J. Zhu, J. Wu, D.W. Zeng, C.S. Xie, J. Electrochem. Soc. 159, H536 (2012)CrossRef
11.
go back to reference H. Tong, Z. Deng, Z. Liu, C. Huang, J. Huang, H. Lan, C. Wang, Y. Cao, Appl. Surf. Sci. 257, 4906 (2011)CrossRef H. Tong, Z. Deng, Z. Liu, C. Huang, J. Huang, H. Lan, C. Wang, Y. Cao, Appl. Surf. Sci. 257, 4906 (2011)CrossRef
12.
go back to reference K.K. Kim, S. Niki, J.Y. Oh, J.O. Song, T.Y. Seong, S.J. Park, S. Fujita, S.W. Kim, J. Appl. Phys. 97, 066103 (2005)CrossRef K.K. Kim, S. Niki, J.Y. Oh, J.O. Song, T.Y. Seong, S.J. Park, S. Fujita, S.W. Kim, J. Appl. Phys. 97, 066103 (2005)CrossRef
13.
14.
15.
go back to reference F.-H. Wang, H.-P. Chang, C.-C. Tseng, C.-C. Huang, Surf. Coat. Technol. 205, 5269 (2011)CrossRef F.-H. Wang, H.-P. Chang, C.-C. Tseng, C.-C. Huang, Surf. Coat. Technol. 205, 5269 (2011)CrossRef
16.
go back to reference J.J. Dong, X.W. Zhang, J.B. You, P.F. Cai, Z.G. Yin, Q. An, X.B. Ma, P. Jin, Z.G. Wang, P.K. Chu, Appl. Mater. Interfaces 2, 1780 (2010)CrossRef J.J. Dong, X.W. Zhang, J.B. You, P.F. Cai, Z.G. Yin, Q. An, X.B. Ma, P. Jin, Z.G. Wang, P.K. Chu, Appl. Mater. Interfaces 2, 1780 (2010)CrossRef
17.
go back to reference W.M. Kim, Y.H. Kim, J.S. Kim, J. Jeong, Y.-J. Baik, J.-K. Park, K.S. Lee, T.-Y. Seong, J. Phys. D Appl. Phys. 43, 365406 (2010)CrossRef W.M. Kim, Y.H. Kim, J.S. Kim, J. Jeong, Y.-J. Baik, J.-K. Park, K.S. Lee, T.-Y. Seong, J. Phys. D Appl. Phys. 43, 365406 (2010)CrossRef
19.
20.
go back to reference D.-H. Kim, S.-H. Lee, G.-H. Lee, H.-B. Kim, K.H. Kim, Y.-G. Lee, T.-H. Yu, J. Appl. Phys. 108, 023520 (2010)CrossRef D.-H. Kim, S.-H. Lee, G.-H. Lee, H.-B. Kim, K.H. Kim, Y.-G. Lee, T.-H. Yu, J. Appl. Phys. 108, 023520 (2010)CrossRef
22.
go back to reference B.-K. Shin, T.-I. Lee, J. Prakash Kar, M.-J. Lee, K.-I. Park, K.-J. Ahn, K.-Y. Yeom, J.-H. Cho, J.-M. Myoung, Mater. Sci. Semicond. Process. 14, 23 (2011)CrossRef B.-K. Shin, T.-I. Lee, J. Prakash Kar, M.-J. Lee, K.-I. Park, K.-J. Ahn, K.-Y. Yeom, J.-H. Cho, J.-M. Myoung, Mater. Sci. Semicond. Process. 14, 23 (2011)CrossRef
25.
go back to reference Y.-C. Lee, S.-Y. Hu, W. Water, Y.-S. Huang, M.-D. Yang, J.-L. Shen, K–.K. Tiong, C–.C. Huang, Solid State Commun. 143, 250 (2007)CrossRef Y.-C. Lee, S.-Y. Hu, W. Water, Y.-S. Huang, M.-D. Yang, J.-L. Shen, K–.K. Tiong, C–.C. Huang, Solid State Commun. 143, 250 (2007)CrossRef
26.
go back to reference Y.-C. Lee, S.-Y. Hu, W. Water, K–.K. Tiong, Z.-C. Feng, Y.-T. Chen, J.-C. Huang, J.-W. Lee, C–.C. Huang, J.-L. Shen, M.-H. Cheng, J. Lumin. 129, 148 (2009)CrossRef Y.-C. Lee, S.-Y. Hu, W. Water, K–.K. Tiong, Z.-C. Feng, Y.-T. Chen, J.-C. Huang, J.-W. Lee, C–.C. Huang, J.-L. Shen, M.-H. Cheng, J. Lumin. 129, 148 (2009)CrossRef
28.
go back to reference W.F. Liu, G.T. Du, Y.F. Sun, J.M. Bian, Y. Cheng, T.P. Yang, Y.C. Chang, Y.B. Xu, Appl. Surf. Sci. 253, 2999 (2007)CrossRef W.F. Liu, G.T. Du, Y.F. Sun, J.M. Bian, Y. Cheng, T.P. Yang, Y.C. Chang, Y.B. Xu, Appl. Surf. Sci. 253, 2999 (2007)CrossRef
29.
go back to reference J. Kim, J.-H. Yun, S.-W. Jee, Y.C. Park, M. Ju, S. Han, Y. Kim, J.-H. Kim, W.A. Anderson, J.-H. Lee, J. Yi, Mater. Lett. 65, 786 (2011)CrossRef J. Kim, J.-H. Yun, S.-W. Jee, Y.C. Park, M. Ju, S. Han, Y. Kim, J.-H. Kim, W.A. Anderson, J.-H. Lee, J. Yi, Mater. Lett. 65, 786 (2011)CrossRef
30.
go back to reference H. Wang, J. Xu, M. Ren, L. Yang, J. Mater. Sci.: Mater. Electron. 21, 33 (2010)CrossRef H. Wang, J. Xu, M. Ren, L. Yang, J. Mater. Sci.: Mater. Electron. 21, 33 (2010)CrossRef
Metadata
Title
Effects of post-rapid thermal annealing on structural, electrical and optical properties of hydrogenated aluminum doped zinc oxide thin films
Authors
Ke Zhu
Ye Yang
Tiefeng Wei
Ruiqin Tan
Ping Cui
Weijie Song
Kwang-Leong Choy
Publication date
01-10-2013
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 10/2013
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-013-1327-7

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