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Journal of Electronic Materials
Published in: Journal of Electronic Materials 9/2002

01-09-2002 | Regular Issue Paper

Electrical characterization of isotropic conductive adhesive under mechanical loading

Authors: Zhimin Mo, Xitao Wang, Tiebing Wang, Shiming Li, Zonghe Lai, Johan Liu

Published in: Journal of Electronic Materials | Issue 9/2002

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previous article Phase equilibria and solidification properties of Sn-Cu-Ni alloys
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Metadata
Title
Electrical characterization of isotropic conductive adhesive under mechanical loading
Authors
Zhimin Mo
Xitao Wang
Tiebing Wang
Shiming Li
Zonghe Lai
Johan Liu
Publication date
01-09-2002
Publisher
Springer-Verlag
Published in
Journal of Electronic Materials / Issue 9/2002
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-002-0183-7

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