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Journal of Electronic Materials
Published in: Journal of Electronic Materials 9/2002

01-09-2002 | Regular Issue Paper

The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements

Authors: C. M. L. Wu, D. Q. Yu, C. M. T. Law, L. Wang

Published in: Journal of Electronic Materials | Issue 9/2002

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previous article Electrical characterization of isotropic conductive adhesive under mechanical loading
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Metadata
Title
The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements
Authors
C. M. L. Wu
D. Q. Yu
C. M. T. Law
L. Wang
Publication date
01-09-2002
Publisher
Springer-Verlag
Published in
Journal of Electronic Materials / Issue 9/2002
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-002-0184-6

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Low-resistance and thermally stable Pd/Ru ohmic contacts to p-type GaN

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Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys

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The thermal property of lead-free Sn-8.55Zn-1Ag-XAl solder alloys and their wetting interaction with Cu

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Phase equilibria and solidification properties of Sn-Cu-Ni alloys

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Effect of heating on the electrical resistivity of conductive adhesive and soldered joints

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Evaluation of the mechanical properties of a ternary Sn-20In-2.8Ag solder