Issue 9/2002
Content (10 Articles)
Regular Issue Paper
Low-resistance and thermally stable Pd/Ru ohmic contacts to p-type GaN
Ja-Soon Jang, Chang-Won Lee, Seong-Ju Park, Tae-Yeon Seong, I. T. Ferguson
Regular Issue Paper
Phase equilibria and solidification properties of Sn-Cu-Ni alloys
Chih-Hao Lin, Sinn-Wen Chen, Chao-Hong Wang
Regular Issue Paper
Electrical characterization of isotropic conductive adhesive under mechanical loading
Zhimin Mo, Xitao Wang, Tiebing Wang, Shiming Li, Zonghe Lai, Johan Liu
Regular Issue Paper
The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements
C. M. L. Wu, D. Q. Yu, C. M. T. Law, L. Wang
Regular Issue Paper
Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys
C. M. L. Wu, D. Q. Yu, C. M. T. Law, L. Wang
Regular Issue Paper
Effect of heating on the electrical resistivity of conductive adhesive and soldered joints
Kyu Dong Kim, D. D. L. Chung
Regular Issue Paper
The thermal property of lead-free Sn-8.55Zn-1Ag-XAl solder alloys and their wetting interaction with Cu
Shou Chang Cheng, Kwang Lung Lin
Regular Issue Paper
Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints
J. G. Lee, F. Guo, S. Choi, K. N. Subramanian, T. R. Bieler, J. P. Lucas
Regular Issue Paper
Evaluation of the mechanical properties of a ternary Sn-20In-2.8Ag solder
M. S. Yeh
Letter
Electrical properties of carbon nitride thin films: Role of morphology and hydrogen content
E. Broitman, N. Hellgren, J. Neidhardt, I. Brunell, L. Hultman