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Journal of Materials Science: Materials in Electronics

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21-08-2021

Electrochemical behaviour of lead-free Sn–0.7Cu–xIn solders alloys in 3.5 wt% NaCl solution

Authors: Dheeraj Jaiswal, Vikrant Singh, Dileep Pathote, C. K. Behera

Published in: Journal of Materials Science: Materials in Electronics | Issue 18/2021

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Abstract

Various electronic equipment has been exposed to a very harsh atmospheric condition that results in corrosion of the solders inside it. The type of corrosion, in most cases, is electrochemical. The lead-free solders are mostly preferred as the solder. Electrochemical corrosion behaviour of lead-free solder Sn–0.7Cu alloys with a variation of indium of x = 0–3 wt% was studied in an air-saturated aqueous solution 3.5 wt% NaCl at room temperature. The potentiodynamic polarization test shows that corrosion resistance improves with In content. The addition of indium refines the microstructure and improve Sn–0.7Cu solder alloys’ corrosion resistance by lowering the current density (I_corr), resulting in high resistance of the passive layer formed. XRD analysis shows that the composition of corrosion products also changed with indium content variation, phases such as Sn₃O(OH)₂Cl₂, and oxides and chlorides of Sn were formed. Electrochemical impedance spectroscopy analysis shows that Indium addition changes the behaviour of the electrochemical interface from charge transfer to diffusion control.

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H. Ma, J. Suhling, A review of mechanical properties of lead-free solders for electronic packaging. J. Mater. Sci. 44, 1141–1158 (2009)CrossRef

L.C. Tsao, Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging. (2006)

K.N. Tu, K. Zeng, Tin-lead (SnPb) solder reaction in flip chip technology. Mater. Sci. Eng. R Rep. 34(1), 1–58 (2001)CrossRef

N. Barry, University of Birmingham Research Archive. (2008)

E.P. Wood, K.L. Nimmo, C.T. Centre, S. Lane, U. Kingdom, J. Electron. Mater. 23(8), 709 (1994)CrossRef

P. Mishra, S.N.Alam, R. Kumar, Effect of Rare Earth Elements on Lead Free Solder Alloys. (2014); 80–86

Y. Kim, K. Kim, C. Hwang, K. Suganuma, E ffect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys. J. Alloys Compd. 352, 237–245 (2003)CrossRef

C. Zweben, Metal-matrix composites for electronic packaging. JOM [Internet] 44(7), 15–23 (1992). https://doi.org/10.1007/BF03222270CrossRef

F. Song, S.W.R. Lee, C.W. Bay, H. Kong, Investigation of the effect of PCB base materials and pad surface finish on the thermal fatigue life of lead-free solder joints of PBGA and passive resistors, in International Conference on Electronic Materials and Packaging. (IEEE, Hong Kong, 2006)

10.

K. Nogita, Intermetallics stabilisation of Cu₆Sn₅ by Ni in Sn–0.7Cu–0.05Ni lead-free solder alloys. Intermetallics [Internet]. 18(1), 145–149 (2010). https://doi.org/10.1016/j.intermet.2009.07.005CrossRef

11.

F. Rosalbino, E. Angelini, G. Zanicchi, R. Marazza, Corrosion behaviour assessment of lead-free Sn–Ag–M (M = In, Bi, Cu) solder alloys. Mater. Chem. Phys. 109(2–3), 386–391 (2008)CrossRef

12.

L.C. Tsao, C.W. Chen, Corrsion characterization of Cu–Sn intermetallics in 3.5 wt.% NaCl solution. Corros. Sci. [Internet]. 63, 393–398 (2012). https://doi.org/10.1016/j.corsci.2012.06.015CrossRef

13.

Y.F. Gao, C.Q. Cheng, J. Zhao, L.H. Wang, X.G. Li, Electrochemical corrosion of Sn–0.75Cu solder joints in NaCl solution. Trans. Nonferrous Met. Soc. China (English Ed [Internet]) 22(4), 977–982 (2012). https://doi.org/10.1016/S1003-6326(11)61273-9CrossRef

14.

L. Yang, Y. Zhang, J. Dai, Y. Jing, J. Ge, N. Zhang, Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy. Mater. Des. [Internet] 67, 209–216 (2015). https://doi.org/10.1016/j.matdes.2014.11.036CrossRef

15.

X. Hu, Y. Lai, X. Jiang, Y. Li, Effects of In addition on the wettability, interfacial characterization and properties of ternary Sn–Cu–Ni solders. J. Mater. Sci. Mater. Electron. [Internet]. 29(21), 18840–18851 (2018). https://doi.org/10.1007/s10854-018-0009-xCrossRef

16.

A.E. Hammad, Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions. Mater. Des. [Internet] 40, 292–298 (2012). https://doi.org/10.1016/j.matdes.2012.04.007CrossRef

17.

M.S. Yeh, Effects of Indium on the mechanical properties of ternary Sn–In–Ag solders. Metall. Mater. Trans. 34, 361–365 (2003)CrossRef

18.

S. Yu, C. Liao, M. Hon, M. Wang, The effects of flux on the wetting characteristics of near-eutectic Sn–Zn–In solder on Cu substrate. J. Mater. Sci. 5(2), 4217–4224 (2000)CrossRef

19.

L. Yang, Y. Zhang, C. Du, J. Dai, N. Zhang, Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy. Microelectron. Reliab. [Internet] 55(3–4), 596–601 (2015). https://doi.org/10.1016/j.microrel.2014.12.017CrossRef

20.

M.F. Mohd Nazeri, A.A. Mohamad, Corrosion resistance of ternary Sn–9Zn–xIn solder joint in alkaline solution. J. Alloys Compd. [Internet] 661, 516–525 (2016). https://doi.org/10.1016/j.jallcom.2015.11.184CrossRef

21.

T.-C. Chang, J.-W. Wang, M.-C. Wang, M.-H. Hon, Solderability of Sn–9Zn–0.5Ag–1In lead-free solder on Cu substrate. J Alloys Compd. 422(1–2), 239–243 (2006)CrossRef

22.

A. Jouaiti, M. Boulghallat, A. Zrineh, R. Lbibb, A. Sabbar, H. Oulfajrite, Electrochemical behavior of a new solder material (Sn–In–Ag). Mater. Lett. 57(28), 4368–4371 (2003)CrossRef

23.

L.F. Li, Y.K. Cheng, G.L. Xu, E.Z. Wang, Z.H. Zhang, H. Wang, Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders. Mater. Design 64, 15–20 (2014)CrossRef

24.

H. Fallahi, M.S. Nurulakmal, A.F. Arezodar, J. Abdullah, Effect of iron and indium on IMC formation and mechanical properties of lead-free solder. Mater. Sci. Eng. A [Internet]. 553, 22–31 (2012)CrossRef

25.

A.A. El-daly, F. El-tantawy, A.E. Hammad, M.S. Gaafar, E.H. El-mossalamy, A.A. Al-ghamdi, Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In. J. Alloys Compd. [Internet] 509(26), 7238–7246 (2011). https://doi.org/10.1016/j.jallcom.2011.01.062CrossRef

26.

T.I. Zubar, V.M. Fedosyuk, A.V. Trukhanov, N.N. Kovaleva, K.A. Astapovich, D.A. Vinnik et al., Control of growth mechanism of electrodeposited nanocrystalline NiFe films. J. Electrochem. Soc. [Internet] 166(6), D173–D180 (2019). https://doi.org/10.1149/2.1001904jesCrossRef

27.

S.C. Chung, J.R. Cheng, S.D. Chiou, H.C. Shih, EIS behavior of anodized zinc in chloride environments. Corros. Sci. 42, 1249–1268 (2000)CrossRef

28.

M. Mouanga, P. Berçot, Comparison of corrosion behaviour of zinc in NaCl and in NaOH solutions; Part II: electrochemical analyses. Corros. Sci. [Internet] 52(12), 3993–4000 (2010). https://doi.org/10.1016/j.corsci.2010.08.018CrossRef

29.

Q. Li, X. Liu, S. Lu, Corrosion behavior assessment of tin-lead and lead free solders exposed to fire smoke generated by burning polyvinyl chloride. Mater. Chem. Phys. [Internet] 212, 298–307 (2018). https://doi.org/10.1016/j.matchemphys.2018.03.057CrossRef

30.

F.E. Heakal, A.M. Fekry, A.A. Ghoneim, Corrosion characterization of new tin–silver binary alloys in nitric acid solutions. Corros. Sci. 50, 1618–1626 (2008)CrossRef

31.

J. Liu, G. Zhang, Z. Wang, Electrochemical behavior of Sn–xZn lead-free solders in aerated NaCI solution, in 2015 16th International Conference on Electronic Packaging Technology (ICEPT). (IEEE, Changsha, 2015), pp. 68–73CrossRef

32.

H. Huang, G. Shuai, X. Wei, C. Yin, Effects of sulfur addition on the wettability and corrosion resistance of Sn–0.7Cu lead-free solder. Microelectron. Reliab. 74, 15–21 (2017)CrossRef

33.

C.W. See, M.Z. Yahaya, H. Haliman, A.A. Mohamad, Corrosion behavior of corroded Sn–3.0Ag–0.5Cu solder alloy. Procedia Chem. [Internet] 19, 847–854 (2016). https://doi.org/10.1016/j.proche.2016.03.112CrossRef

34.

P. Marcus, V. Maurice, H.H. Strehblow, Localized corrosion (pitting): a model of passivity breakdown including the role of the oxide layer nanostructure. Corros. Sci. 50(9), 2698–2704 (2008)CrossRef

35.

D.D. MacDonald, The history of the point defect model for the passive state: a brief review of film growth aspects. Electrochim. Acta [Internet] 56(4), 1761–1772 (2011). https://doi.org/10.1016/j.electacta.2010.11.005CrossRef

36.

W.R. Osório, L.C. Peixoto, L.R. Garcia, A. Garcia, J.E. Spinelli, The effects of microstructure and Ag₃Sn and Cu₆Sn₅ intermetallics on the electrochemical behavior of Sn–Ag and Sn–Cu solder alloys. Int. J. Electrochem. Sci 7, 6452 (2012)

37.

W.R. Osório, E.S. Freitas, J.E. Spinelli, A. Garcia, Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution. Corros. Sci. 80, 71–81 (2014)CrossRef

38.

W.R. Osório, J.E. Spinelli, C.R.M. Afonso, L.C. Peixoto, A. Garcia, Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn–Cu solder alloy. Electrochim. Acta. 56(24), 8891–8899 (2011)CrossRef

39.

K. Kanlayasiri, K. Sukpimai, Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate. J Alloys Compd. 25(668), 169–175 (2016)CrossRef

40.

J.C. Liu, S.W. Park, S. Nagao, M. Nogi, H. Koga, J.S. Ma et al., The role of Zn precipitates and Cl- anions in pitting corrosion of Sn–Zn solder alloys. Corros. Sci. [Internet] 92, 263–271 (2015). https://doi.org/10.1016/j.corsci.2014.12.014CrossRef

41.

Z. Wang, C. Chen, J. Liu, G. Zhang, K. Suganuma, Corrosion mechanism of Zn–30Sn high-temperature, lead-free solder in neutral NaCl solution. Corros. Sci. [Internet] 140, 40–50 (2018). https://doi.org/10.1016/j.corsci.2018.06.025CrossRef

42.

A. Aliyu, C. Srivastava, Correlation between growth texture, crystallite size, lattice strain and corrosion behavior of copper-carbon nanotube composite coatings. Surf. Coatings Technol. 405, 126596 (2021)CrossRef

43.

A.V. Trukhanov, K.A. Darwish, M.M. Salem, O.M. Hemeda, M.I. Abdel Ati, M.A. Darwish et al., Impact of the heat treatment conditions on crystal structure, morphology and magnetic properties evolution in BaM nanohexaferrites. J. Alloys. Compd. [Internet] 866, 158961 (2021). https://doi.org/10.1016/j.jallcom.2021.158961CrossRef

Title: Electrochemical behaviour of lead-free Sn–0.7Cu–xIn solders alloys in 3.5 wt% NaCl solution
Authors: Dheeraj Jaiswal
Vikrant Singh
Dileep Pathote
C. K. Behera
Publication date: 21-08-2021
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 18/2021
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-021-06824-3

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