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Advances in Manufacturing
Published in: Advances in Manufacturing 3/2013

01-09-2013

Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming

Authors: Nadezhda Strusevich, Marc P. Y. Desmulliez, Eitan Abraham, David Flynn, Thomas Jones, Mayur Patel, Christopher Bailey

Published in: Advances in Manufacturing | Issue 3/2013

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Abstract

This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via’s), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.
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Literature
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Strusevich N, Bailey C, Costello S, Patel M, Desmulliez MPY (2013) Numerical modeling of electroplating process for microvia fabrication. In: Euro SimE conference, Wroclaw, Poland, April 2013
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Metadata
Title
Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming
Authors
Nadezhda Strusevich
Marc P. Y. Desmulliez
Eitan Abraham
David Flynn
Thomas Jones
Mayur Patel
Christopher Bailey
Publication date
01-09-2013
Publisher
Springer Berlin Heidelberg
Published in
Advances in Manufacturing / Issue 3/2013
Print ISSN: 2095-3127
Electronic ISSN: 2195-3597
DOI
https://doi.org/10.1007/s40436-013-0039-9

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